Hong-Hyun Bae

Orcid: 0000-0002-7062-5490

According to our database1, Hong-Hyun Bae authored at least 7 papers between 2022 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2024
14.10 34.7A/mm<sup>2</sup> Scalable Distributed All-Digital 6×6 Dot-LDOs Featuring Freely Linkable Current-Sharing Network: A Fine-Grained On-Chip Power Delivery Solution in 28nm CMOS.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024

28.1 A Fully Integrated, Domino-Like-Buffered Analog LDO Achieving -28dB Worst-Case Power-Supply Rejection Across the Frequency Spectrum from 10Hz to 1GHz with 50pF On-Chip Capacitance.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024

2022
A Fully Integrated Multi-Phase Buck Converter With On-Chip Capacitor Dynamic Re-Allocation and Fine-Grained Phase-Shedding Techniques.
IEEE J. Solid State Circuits, 2022

A Monolithic 48V-to-1V 10A Quadruple Step-Down DC-DC Converter with Hysteretic Copied On-Time 4-Phase Control and 2× Slew Rate All-Hysteretic Mode.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

A Fully-Integrated 0.9W/mm<sup>2</sup> 79.1%-Efficiency 200MHz Multi-Phase Buck Converter with Flying-Capacitor-Based Inter-Inductor Current Balancing Technique.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

A 97.6%-Efficient 1-2MHz Hysteretic Buck Converter with 7V/μs DVS-Rate Enabled by Isosceles-Triangular Shunt Current Push-Pull Technique.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

A 1.23W/mm<sup>2</sup> 83.7%-Efficiency 400MHz 6-Phase Fully Integrated Buck Converter in 28nm CMOS with On-Chip Capacitor Dynamic Re-Allocation for Inter-Inductor Current Balancing and Fast DVS of 75mV/ns.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022


  Loading...