Gyeong-Gu Kang
Affiliations:- KAIST, South Korea
According to our database1,
Gyeong-Gu Kang
authored at least 20 papers
between 2018 and 2024.
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Bibliography
2024
A Display Source-Driver IC Featuring Multistage-Cascaded 10-Bit DAC and True-DC-Interpolative Super-OTA Buffer.
IEEE J. Solid State Circuits, April, 2024
26.1 A 600ch 10b Source-Driver IC with a Charge-Modulation DAC Achieving 1-Horizontal Time of 1.5μs Suitable for 240Hz-Frame-Rate Mobile Displays.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024
2023
An Area-Efficient 10-Bit Source-Driver IC With LSB-Stacked LV-to-HV-Amplify DAC for Mobile OLED Displays.
IEEE J. Solid State Circuits, November, 2023
A Mobile OLED Source-Driver IC featuring Ultra-Compact 3-Stage-Cascaded 10-Bit DAC and 42V/μs-Slew-Rate True-DC-Interpolative Super-OTA Buffer.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
2022
A Triboelectric Energy-Harvesting Interface With Scalable Multi-Chip-Stacked Bias-Flip and Daisy-Chained Synchronous Signaling Techniques.
IEEE J. Solid State Circuits, 2022
A 5.6W-Power 96.6%-Efficiency Boost-Oriented SIDO Step-Up/Down DC-DC Converter Embedding Buck Conversion with an Energy-Balancing Capacitor.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
A Monolithic 48V-to-1V 10A Quadruple Step-Down DC-DC Converter with Hysteretic Copied On-Time 4-Phase Control and 2× Slew Rate All-Hysteretic Mode.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
A 97.6%-Efficient 1-2MHz Hysteretic Buck Converter with 7V/μs DVS-Rate Enabled by Isosceles-Triangular Shunt Current Push-Pull Technique.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
A 10b Source-Driver IC with LSB-Stacked LV-to-HV-Amplify DAC Achieving 2688μm<sup>2</sup>/channel and 4.8mV DVO for Mobile OLED Displays.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
A 130V Triboelectric Energy-Harvesting Interface in .18µm BCD with Scalable Multi-Chip-Stacked Bias-Flip and Daisy-Chained Synchronous Signaling Technique.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
A Pipeline ADC with Negative C-assisted SC Amplifier Canceling Gain Error and Nonlinearity.
Proceedings of the 48th IEEE European Solid State Circuits Conference, 2022
2021
A 5-V Dynamic Class-C Paralleled Single-Stage Amplifier With Near-Zero Dead-Zone Control and Current-Redistributive Rail-to-Rail Gm-Boosting Technique.
IEEE J. Solid State Circuits, 2021
A 96.6%-Efficiency Continuous-Input-Current Hybrid Dual-Path Buck-Boost Converter with Single-Mode Operation and Non-Stopping Output Current Delivery.
Proceedings of the 2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021, 2021
A 4.5V-Input 0.3-to-1.7V-Output Step-Down Always-Dual-Path DC-DC Converter Achieving 91.5%-Efficiency with 250mΩ-DCR Inductor for Low-Voltage SoCs.
Proceedings of the 2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021, 2021
A 12-Bit Mobile OLED/μLED Display Driver IC with Cascaded Loading-Free Capacitive Interpolation DAC and 6.24V/μs-Slew-Rate Buffer Amplifier.
Proceedings of the 2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021, 2021
A 5V Dynamic Class-C Paralleled Single-Stage Amplifier with Near-Zero Dead-Zone Control and Current-Redistributive Rail-to-Rail Gm-Boosting Technique.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021
2020
An 8Ω, 1.4W, 0.0024% THD+N Class-D Audio Amplifier with Bridge-Tied Load Half-Side Switching Mode Achieving Low Standby Quiescent Current of 660μA.
Proceedings of the IEEE Symposium on VLSI Circuits, 2020
11.8 A 96.8%-Efficiency Continuous Input/Output-Current Step-Up/Down Converter Powering Disposable IoTs with Reconfigurable Multi-Cell-Balanced Alkaline Batteries.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020
2018
A 97% high-efficiency 6μs fast-recovery-time buck-based step-up/down converter with embedded 1/2 and 3/2 charge-pumps for li-lon battery management.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018
A 100mK-NETD 100ms-startup-time 80×60 micro-bolometer CMOS thermal imager integrated with a 0.234mm<sup>2</sup> 1.89μVrms noise 12b biasing DAC.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018