Jingwei Cai

According to our database, Jingwei Cai authored at least 8 papers between 2019 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Gemini: Mapping and Architecture Co-exploration for Large-scale DNN Chiplet Accelerators.

Jingwei Cai, Zuotong Wu, Sen Peng, Yuchen Wei, Zhanhong Tan, Guiming Shi, Mingyu Gao, Kaisheng Ma

Proceedings of the IEEE International Symposium on High-Performance Computer Architecture, 2024

2023

All-van der Waals stacking ferroelectric field-effect transistor based on In2Se3 for high-density memory.

Xiaojie Wang, Zeyang Feng, Jingwei Cai, Hao Tong, Xiangshui Miao

Sci. China Inf. Sci., August, 2023

A 28nm 68MOPS 0.18\mu\mathrm{J}/\text{Op}$ Paillier Homomorphic Encryption Processor with Bit-Serial Sparse Ciphertext Computing.

Guiming Shi, Zhanhong Tan, Dapeng Cao, Jingwei Cai, Wuke Zhang, Yifu Wu, Kaisheng Ma

Proceedings of the IEEE International Solid- State Circuits Conference, 2023

Inter-layer Scheduling Space Definition and Exploration for Tiled Accelerators.

Jingwei Cai, Yuchen Wei, Zuotong Wu, Sen Peng, Kaisheng Ma

Proceedings of the 50th Annual International Symposium on Computer Architecture, 2023

PHEP: Paillier Homomorphic Encryption Processors for Privacy-Preserving Applications in Cloud Computing.

Guiming Shi, Yi Li, Xueqiang Wang, Zhanhong Tan, Dapeng Cao, Jingwei Cai, Yuchen Wei, Zehua Li, Wuke Zhang, Yifu Wu, Wei Xu, Kaisheng Ma

Proceedings of the 35th IEEE Hot Chips Symposium, 2023

2021

Simulation Analysis of Joint Connection of New Epoxy Resin Concrete Truss Structure.

Yujie Jin, Yi Zhao, Xie Xinying, Zhang Xuan, Jingwei Cai

Int. J. Perform. Eng., 2021

2020

Nonparametric Range-Based Double Smoothing Spot Volatility Estimation for Diffusion Models.

Jingwei Cai

Complex., 2020

2019

Design Considerations of Data Converters for Industrial Technology.

Hua Fan, Jiayi Zhang, Jingwei Cai, Quanyuan Feng, Dagang Li, Kelin Zhang, Daqian Hu, Dezhi Xing, Hongrui Che, Yuanjun Cen, Hadi Heidari

Proceedings of the International Conference on IC Design and Technology, 2019