Kan Wang

Orcid: 0000-0003-0704-8069

Affiliations:
  • Tsinghua University, Beijing, China


According to our database1, Kan Wang authored at least 9 papers between 2011 and 2014.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

Online presence:

On csauthors.net:

Bibliography

2014
Mixed-Crossing-Avoided Escape Routing of Mixed-Pattern Signals on Staggered-Pin-Array PCBs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014

Post-floorplanning power optimization for MSV-driven application specific NoC design.
Proceedings of the IEEE International Symposium on Circuits and Systemss, 2014

2013
Escape routing of mixed-pattern signals based on staggered-pin-array PCBs.
Proceedings of the International Symposium on Physical Design, 2013

Power optimization for application-specific 3D network-on-chip with multiple supply voltages.
Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013

2012
Leakage-aware performance-driven TSV-planning based on network flow algorithm in 3D ICs.
Proceedings of the Thirteenth International Symposium on Quality Electronic Design, 2012

Voltage island-driven power optimization for application specific network-on-chip design.
Proceedings of the Great Lakes Symposium on VLSI 2012, 2012

Multi-Objective Light Ray Optimization.
Proceedings of the Fifth International Joint Conference on Computational Sciences and Optimization, 2012

2011
Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2011

Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs.
Proceedings of the 16th Asia South Pacific Design Automation Conference, 2011


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