Kanji Otsuka

According to our database, Kanji Otsuka authored at least 7 papers between 2009 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

Institutions and the transmission of upper-tail human capital: scientific lineages across a millennium.

Hiroyuki Chuma, Kanji Otsuka, Yoichi Sato

CoRR, May, 2026

How to Build Marcus's Algebraic Mind: Algebro-Deterministic Substrate over Galois Fields.

Hiroyuki Chuma, Kanji Otsuka, Yoichi Sato

CoRR, May, 2026

Bridging Silicon and the Hippocampus: Algebro-Deterministic Memory "VaCoAl" as a Substrate for Vector-HaSH and TEM.

Hiroyuki Chuma, Kanji Otsuka, Yoichi Sato

CoRR, May, 2026

Beyond LLMs, Sparse Distributed Memory, and Neuromorphics.

Hiroyuki Chuma, Kanji Otsuka, Yoichi Sato

CoRR, April, 2026

2011

PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system.

Katsuya Kikuchi, Chihiro Ueda, Fumiaki Fujii, Yutaka Akiyama, Naoya Watanabe, Yasuhiro Kitamura, Toshio Gomyo, Toshikazu Okubo, Tetsuya Koyama, Tadashi Kamada, Masahiro Aoyagi, Kanji Otsuka

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009

SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration.

Koichi Takemura, Katsuya Kikuchi, Chihiro Ueda, Kazuhiro Baba, Masahiro Aoyagi, Kanji Otsuka

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates.

Katsuya Kikuchi, Koichi Takemura, Chihiro Ueda, Osamu Shimada, Toshio Gomyo, Yukiharu Takeuchi, Toshikazu Okubo, Kazuhiro Baba, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka

Proceedings of the IEEE International Conference on 3D System Integration, 2009