Kanji Otsuka

According to our database1, Kanji Otsuka authored at least 3 papers between 2009 and 2011.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Awards

IEEE Fellow

IEEE Fellow 1998, "For contributions to Ceramic Multilayer Substrate, IC and LSI Packaging Technology and Multichip Module Technology.".

Timeline

Legend:

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In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2011
PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009
SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration.
Proceedings of the IEEE International Conference on 3D System Integration, 2009

Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates.
Proceedings of the IEEE International Conference on 3D System Integration, 2009


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