Koichi Takemura

According to our database, Koichi Takemura authored at least 9 papers between 2009 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate.

Takeru Amano, Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Takayuki Kurosu, Koichi Takemura, Tsuyoshi Aoki, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021

Error-Free Operation for Fully Connected Wavelength-Routing Interconnect among 8 FPGAs with 2.8-Tbit/s Total Bandwidth.

Takanori Shimizu, Shigeru Nakamura, Hiroshi Yamaguchi, Koichi Takemura, Kenji Mizutani, Tatsuya Usuki, Yutaka Urino

Proceedings of the European Conference on Optical Communication, 2021

2020

Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors.

Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Koichi Takemura, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi, Takeru Amano

Proceedings of the European Conference on Optical Communications, 2020

2019

Fingertip-Size Optical Module, "Optical I/O Core", and Its Application in FPGA.

Takahiro Nakamura, Kenichiro Yashiki, Kenji Mizutani, Takaaki Nedachi, Junichi Fujikata, Masatoshi Tokushima, Jun Ushida, Masataka Noguchi, Daisuke Okamoto, Yasuyuki Suzuki, Takanori Shimizu, Koichi Takemura, Akio Ukita, Yasuhiro Ibusuki, Mitsuru Kurihara, Keizo Kinoshita, Tsuyoshi Horikawa, Hiroshi Yamaguchi, Junichi Tsuchida, Yasuhiko Hagihara, Kazuhiko Kurata

IEICE Trans. Electron., 2019

Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers.

Koichi Takemura, Akio Ukita, Yasuhiro Ibusuki, Mitsuru Kurihara, Akihiro Noriki, Takeru Amano, Daisuke Okamoto, Yasuyuki Suzuki, Kazuhiko Kurata

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2015

5 mW/Gbps hybrid-integrated Si-photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF.

Kenichiro Yashiki, Yasuyuki Suzuki, Yasuhiko Hagihara, Mitsuru Kurihara, Masatoshi Tokushima, Junichi Fujikata, Akio Ukita, Koichi Takemura, Takanori Shimizu, Daisuke Okamoto, Jun Ushida, Shigeki Takahashi, Toshinori Uemura, Makoto Okano, Junichi Tsuchida, Takaaki Nedachi, Makoto Fushimi, Ichiro Ogura, Jun Inasaka, Kazuhiko Kurata

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2015

2010

3D stacked buck converter with 15μm thick spiral inductor on silicon interposer for fine-grain power-supply voltage control in SiP's.

Koichi Ishida, Koichi Takemura, Kazuhiro Baba, Makoto Takamiya, Takayasu Sakurai

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration.

Koichi Takemura, Katsuya Kikuchi, Chihiro Ueda, Kazuhiro Baba, Masahiro Aoyagi, Kanji Otsuka

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates.

Katsuya Kikuchi, Koichi Takemura, Chihiro Ueda, Osamu Shimada, Toshio Gomyo, Yukiharu Takeuchi, Toshikazu Okubo, Kazuhiro Baba, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka

Proceedings of the IEEE International Conference on 3D System Integration, 2009