Kazuhiro Baba

According to our database, Kazuhiro Baba authored at least 5 papers between 2004 and 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2010

3D stacked buck converter with 15μm thick spiral inductor on silicon interposer for fine-grain power-supply voltage control in SiP's.

Koichi Ishida, Koichi Takemura, Kazuhiro Baba, Makoto Takamiya, Takayasu Sakurai

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration.

Koichi Takemura, Katsuya Kikuchi, Chihiro Ueda, Kazuhiro Baba, Masahiro Aoyagi, Kanji Otsuka

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates.

Katsuya Kikuchi, Koichi Takemura, Chihiro Ueda, Osamu Shimada, Toshio Gomyo, Yukiharu Takeuchi, Toshikazu Okubo, Kazuhiro Baba, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2005

Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs.

Tadanori Shimoto, Kazuhiro Baba, Koji Matsui, Jun Tsukano, Takehiko Maeda, Kenji Oyachi

Microelectron. Reliab., 2005

2004

High-performance FCBGA based on multi-layer thin-substrate packaging technology.

Tadanori Shimoto, Katsumi Kikuchi, Kazuhiro Baba, Koji Matsui, Hirokazu Honda, Keiichiro Kata

Microelectron. Reliab., 2004