Kei Hagiwara

According to our database, Kei Hagiwara authored at least 5 papers between 2015 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Prioritization of Distribution Networks with Distributed Energy Resources for Efficient Deployment of Loss Minimum Reconfiguration Technology.

Kei Hagiwara, Yu Fujimoto, Yasuhiro Kodama, Yasuhiro Hayashi, Ryo Maeda, Kohei Oishi, Kenjiro Mori

Proceedings of the IEEE PES Innovative Smart Grid Technologies - Asia, 2023

2019

Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers.

Masahide Goto, Joeri De Vos, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Yuki Honda, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Quarter Video Graphics Array Full-Digital Image Sensing with Wide Dynamic Range and Linear Output Using Pixel-Wise 3D Integration.

Masahide Goto, Yuki Honda, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto

Proceedings of the IEEE International Symposium on Circuits and Systems, 2018

2017

Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method.

Eiji Higurashi, Ken Okumura, Yutaka Kunimune, Tadatomo Suga, Kei Hagiwara

IEICE Trans. Electron., 2017

2015

Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers.

Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto

Proceedings of the 2015 International 3D Systems Integration Conference, 2015