Kimihiro Yamanaka

According to our database1, Kimihiro Yamanaka authored at least 13 papers between 2007 and 2021.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2021
Emotion Estimating Method by Using Voice and Facial Expression Parameters.
Proceedings of the Computer Information Systems and Industrial Management, 2021

2020
Classification of Visual Attention Level During Target Gazing Using Microsaccades.
Trans. Comput. Sci., 2020

Proposal for Visual Attention Level Based on Microsaccades after Saccades.
Proceedings of the 2020 IEEE International Conference on Systems, Man, and Cybernetics, 2020

2018
Quantitative Usability Testing Based on Eye Fixation-Related Potentials.
Proceedings of the HCI International 2018, 2018

2016
Relation Between Mental Workload and Useful Field of View in Elderly.
Proceedings of the HCI International 2016 - Posters' Extended Abstracts, 2016

2015
Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density.
Microelectron. Reliab., 2015

2014
Basic Research on the Factors Influencing Perception of Texture from Images.
Proceedings of the Human Interface and the Management of Information. Information and Knowledge Design and Evaluation, 2014

2013
Measurement of Useful Field of View during Ocular Following Response.
Proceedings of the HCI International 2013 - Posters' Extended Abstracts, 2013

2011
Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint.
Microelectron. Reliab., 2011

2010
Biometric verification using the motion of fingers: a combination of physical and behavioural biometrics.
Int. J. Biom., 2010

2008
Hybrid fingerprint authentication using artifact-metrics.
Int. J. Biom., 2008

A Study of Visibility Evaluation for the Combination of Character Color and Background Color on a Web Page.
Proceedings of the Second International Conference on Secure System Integration and Reliability Improvement, 2008

2007
Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system.
Microelectron. Reliab., 2007


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