Keun-Soo Kim

According to our database, Keun-Soo Kim authored at least 3 papers between 2007 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2012

Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish.

Hitoshi Sakurai, Keun-Soo Kim, Kiju Lee, Chang-Jae Kim, Youichi Kukimoto, Katsuaki Suganuma

Microelectron. Reliab., 2012

2011

Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint.

Kiju Lee, Keun-Soo Kim, Yutaka Tsukada, Katsuaki Suganuma, Kimihiro Yamanaka, Soichi Kuritani, Minoru Ueshima

Microelectron. Reliab., 2011

2007

Properties of low temperature Sn-Ag-Bi-In solder systems.

Keun-Soo Kim, Takayuki Imanishi, Katsuaki Suganuma, Minoru Ueshima, Rikiya Kato

Microelectron. Reliab., 2007