Lingfeng Zhou
Orcid: 0009-0005-0437-0310
According to our database1,
Lingfeng Zhou
authored at least 19 papers
between 2016 and 2025.
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Bibliography
2025
DeepCircuitX: A Comprehensive Repository-Level Dataset for RTL Code Understanding, Generation, and PPA Analysis.
CoRR, February, 2025
CoRR, February, 2025
IEEE Trans. Very Large Scale Integr. Syst., January, 2025
Proceedings of the 26th International Symposium on Quality Electronic Design, 2025
2024
Toward Efficient Asynchronous Circuits Design Flow Using Backward Delay Propagation Constraint.
IEEE Trans. Very Large Scale Integr. Syst., October, 2024
IEEE Trans. Circuits Syst. II Express Briefs, August, 2024
Better-Than-Worst-Case: A Frequency Adaptation Asynchronous RISC-V Core With Vector Extension.
IEEE Trans. Very Large Scale Integr. Syst., June, 2024
Deep learning nomogram for preoperative distinction between Xanthogranulomatous cholecystitis and gallbladder carcinoma: A novel approach for surgical decision.
Comput. Biol. Medicine, January, 2024
Intelligent Computing Social Modeling and Methodological Innovations in Political Science in the Era of Large Language Models.
CoRR, 2024
HumanSim: Human-Like Multi-agent Novel Driving Simulation for Corner Case Generation.
Proceedings of the Computer Vision - ECCV 2024 Workshops, 2024
An Efficient Asynchronous Circuits Design Flow with Backward Delay Propagation Constraint.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2024
2023
Gated Recurrent Unit Embedded with Dual Spatial Convolution for Long-Term Traffic Flow Prediction.
ISPRS Int. J. Geo Inf., September, 2023
Influential Topographic Factor Identification of Soil Heavy Metals Using GeoDetector: The Effects of DEM Resolution and Pollution Sources.
Remote. Sens., August, 2023
Towards Energy-Efficient Asynchronous Circuit Design with Flip-Flop-to-Latch Replacement.
Proceedings of the IEEE International Conference on Integrated Circuits, 2023
2016
Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016