Yangyang Yan

According to our database1, Yangyang Yan authored at least 3 papers between 2014 and 2016.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2016
Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner.
Microelectronics Reliability, 2014


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