Yangyang Yan

According to our database, Yangyang Yan authored at least 13 papers between 2014 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

BloClaw: An Omniscient, Multi-Modal Agentic Workspace for Next-Generation Scientific Discovery.

Yao Qin, Yangyang Yan, Jinhua Pang, Xiaoming Zhang

CoRR, April, 2026

2025

Classification of nighttime light types in China's nature protected areas based on SDGSAT-1.

Yangyang Yan, Rong Zhang, Zongming Wang, Chuanpeng Zhao, Haihang Zeng, Qian Shi, Mingming Jia

Int. J. Digit. Earth, December, 2025

Zero-Training Task-Specific Model Synthesis for Few-Shot Medical Image Classification.

Yao Qin, Yangyang Yan, YuanChao Yang, Jinhua Pang, Huanyong Bi, Yuan Liu, HaiHua Wang

CoRR, November, 2025

2024

AI Algorithm for Ultra-widefield Fundus Imaging for Diabetic Retinopathy - RDR, DME.

Bo Yang, Yue Zhang, Di Liu, Qicheng Li, Yangyang Yan

Proceedings of the Ultra-Widefield Fundus Imaging for Diabetic Retinopathy, 2024

AI-Based Diagnostic Model for Predicting ci-DME Development.

Bo Yang, Yangyang Yan, Wencheng Miao

Proceedings of the Image-Based Prediction of Retinal Disease Progression, 2024

Image Quality Assessment with Model Fusion for Ultra-widefield Fundus.

Bo Yang, Yangyang Yan, Di Liu, Qicheng Li, Yue Zhang

Proceedings of the Ultra-Widefield Fundus Imaging for Diabetic Retinopathy, 2024

2022

DeepIDA: Predicting Isoform-Disease Associations by Data Fusion and Deep Neural Networks.

Guoxian Yu, Yeqian Yang, Yangyang Yan, Maozu Guo, Xiangliang Zhang, Jun Wang

IEEE ACM Trans. Comput. Biol. Bioinform., 2022

Analyzing the Dynamic Spatiotemporal Changes in Urban Extension across Zhejiang Province Using NPP-VIIRS Nighttime Light Data.

Yangyang Yan, Hui Lei, Yihong Chen, Bin Zhou

Remote. Sens., 2022

Research on Ni₃Sn₄ intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps.

Fengwei Dai, David Wei Zhang, Yangyang Yan, Guojun Wang, Liqiang Cao

IEICE Electron. Express, 2022

2020

Influence of Fluid on Seal and Assembly of Pipeline Fittings Based on the Multiscale Finite Element Model.

Yangyang Yan, Yaping Fan

Complex., 2020

2016

Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias.

Yangyang Yan, Ziyue Zhang, Zhiqiang Cheng, Lingfeng Zhou, Zhiming Chen, Yingtao Ding

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications.

Yangyang Yan, Yingtao Ding, Qianwen Chen, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner.

Yingtao Ding, Yangyang Yan, Qianwen Chen, Shiwei Wang, Rui Su, Hua Dang

Microelectron. Reliab., 2014