According to our database1, Yangyang Yan authored at least 3 papers between 2014 and 2016.
Legend:Book In proceedings Article PhD thesis Other
Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner.
Microelectronics Reliability, 2014