M. Mayer

This page is a disambiguation page, it actually contains mutiple papers from persons of the same or a similar name.

Bibliography

2015
Development of a fast method for optimization of Au ball bond process.
Microelectron. Reliab., 2015

2013
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding.
Microelectron. Reliab., 2013

2011
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding.
Microelectron. Reliab., 2011

Role of process parameters on bondability and pad damage indicators in copper ball bonding.
Microelectron. Reliab., 2011

Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding.
Microelectron. Reliab., 2011

2009
Measuring stress next to Au ball bond during high temperature aging.
Microelectron. Reliab., 2009

2008
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging.
Microelectron. Reliab., 2008

2004
Leafing digital content.
Proceedings of the 9th International Conference on Intelligent User Interfaces, 2004

1994
Übergang zwischen ISO/OSI-Anwendungsprotokollen X.400 und MAP MMS für eine KKS-Laboranbindung.
Proceedings of the Medizin und Information, 1994


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