John Persic

According to our database, John Persic authored at least 4 papers between 2009 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2011

Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding.

Aashish Shah, Alireza Rezvani, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon

Microelectron. Reliab., 2011

Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding.

A. Pequegnat, H. J. Kim, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon

Microelectron. Reliab., 2011

Influence of gold pick up on the hardness of copper free air ball.

Jae-sik Lee, Michael Mayer, Norman Y. Zhou, J. T. Moon, John Persic

Microelectron. Reliab., 2011

2009

Measuring stress next to Au ball bond during high temperature aging.

M. Mayer, J. T. Moon, John Persic

Microelectron. Reliab., 2009