Meiying Su

According to our database, Meiying Su authored at least 4 papers between 2018 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures.

Yunting Liu, Rong Fu, Meiying Su, Jun Li, Chuan Chen, Fengman Liu

Microelectron. J., 2025

AI-Based Prediction of Warpage in Organic Substrates.

Jingyi Zhao, Meiying Su, Rui Ma

IEEE Access, 2025

2021

Design and Implementation of Financial Management Analysis Based on Big Data Platform of Psychiatric Hospital.

Meiying Su, Xinlei Chen

Proceedings of the Multimedia Technology and Enhanced Learning, 2021

2018

Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process.

Meiying Su, Liqiang Cao, Tingyu Lin, Feng Chen, Jun Li, Cheng Chen, Gengxin Tian

Microelectron. Reliab., 2018