Miroslav Vasic

According to our database, Miroslav Vasic authored at least 7 papers between 2012 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Additive Manufacturing of Nitinol for Smart Personalized Medical Devices: Current Capabilities and Challenges.

Andrés Díaz Lantada, Carlos Aguilar, Rodrigo Zapata Martínez, Mónica Echeverry Rendón, Muzi Li, Oscar Contreras-Almengor, Jesús Ordoño, William Solórzano-Requejo, Miroslav Vasic, Juan Manuel Muñoz-Guijosa, Jon Molina-Aldareguia

Proceedings of the 17th International Joint Conference on Biomedical Engineering Systems and Technologies, 2024

2023

Thermal and Voltage-Aware Performance Management of 3-D MPSoCs With Flow Cell Arrays and Integrated SC Converters.

Halima Najibi, Alexandre Levisse, Giovanni Ansaloni, Marina Zapater, Miroslav Vasic, David Atienza

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2023

Artificial Neural Network Based Thermal Model for a Three-Phase Medium Frequency Transformer.

David Molinero, Daniel Santamargarita, Emilio Bueno, Marta Marrón, Miroslav Vasic

Proceedings of the 32nd IEEE International Symposium on Industrial Electronics, 2023

2021

Configurable High-Frequency Alternating Magnetic Field Generator for Nanomedical Magnetic Hyperthermia Applications.

Michael Zeinoun, Diego Serrano, Pablo Tezanos Medina, Óscar García, Miroslav Vasic, José Javier Serrano Olmedo

IEEE Access, 2021

2020

Enabling Optimal Power Generation of Flow Cell Arrays in 3D MPSoCs with On-Chip Switched Capacitor Converters.

Halima Najibi, Jorge Hunter, Alexandre Levisse, Marina Zapater, Miroslav Vasic, David Atienza

Proceedings of the 2020 IEEE Computer Society Annual Symposium on VLSI, 2020

2014

Physical model for GaN HEMT design optimization in high frequency switching applications.

D. Cucak, Miroslav Vasic, Óscar García, Yves Bouvier, Jesús Ángel Oliver, Pedro Alou, José A. Cobos, A. Wang, S. Martin-Horcajo, F. Romero, Fernando Calle

Proceedings of the 44th European Solid State Device Research Conference, 2014

2012

Three-Level Cell Topology for a Multilevel Power Supply to Achieve High Efficiency Envelope Amplifier.

Daniel Diaz, Miroslav Vasic, Óscar García, Jesús Ángel Oliver, Pedro Alou, Roberto Prieto, José A. Cobos

IEEE Trans. Circuits Syst. I Regul. Pap., 2012