Muhammad Imran

Orcid: 0000-0002-6246-6143

Affiliations:
  • National University of Sciences and Technology, School of Electrical Engineering and Computer Science, Department of Electrical Engineering, Islamabad, Pakistan
  • Sungkyunkwan University, Department of Electrical and Computer Engineering, Suwon, South Korea (PhD 2020)


According to our database1, Muhammad Imran authored at least 14 papers between 2018 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Bibliography

2024
HYDRA: A Hybrid Resistance Drift Resilient Architecture for Phase Change Memory-Based Neural Network Accelerators.
IEEE Trans. Computers, September, 2024

2023
CRAFT: Criticality-Aware Fault-Tolerance Enhancement Techniques for Emerging Memories-Based Deep Neural Networks.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., October, 2023

2022
ADAPT: A Write Disturbance-Aware Programming Technique for Scaled Phase Change Memory.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

CEnT: An Efficient Architecture to Eliminate Intra-Array Write Disturbance in PCM.
IEEE Trans. Computers, 2022

DynaPAT: A Dynamic Pattern-Aware Encoding Technique for Robust MLC PCM-Based Deep Neural Networks.
Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, 2022

2021
Reliability Enhanced Heterogeneous Phase Change Memory Architecture for Performance and Energy Efficiency.
IEEE Trans. Computers, 2021

Low-Cost and Effective Fault-Tolerance Enhancement Techniques for Emerging Memories-Based Deep Neural Networks.
Proceedings of the 58th ACM/IEEE Design Automation Conference, 2021

2020
Virtual-Tile-Based Flip-Flop Alignment Methodology for Clock Network Power Optimization.
IEEE Trans. Very Large Scale Integr. Syst., 2020

Pattern-Aware Encoding for MLC PCM Storage Density, Energy Efficiency, and Performance Enhancement.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020

Cost-Effective Reliable MLC PCM Architecture Using Virtual Data Based Error Correction.
IEEE Access, 2020

Virtualization-Based Efficient TSV Repair for 3-D Integrated Circuits.
IEEE Access, 2020

Effective Write Disturbance Mitigation Encoding Scheme for High-density PCM.
Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition, 2020

2019
Flipcy: Efficient Pattern Redistribution for Enhancing MLC PCM Reliability and Storage Density.
Proceedings of the International Conference on Computer-Aided Design, 2019

2018
Heterogeneous PCM array architecture for reliability, performance and lifetime enhancement.
Proceedings of the 2018 Design, Automation & Test in Europe Conference & Exhibition, 2018


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