Prachi Shukla

According to our database, Prachi Shukla authored at least 11 papers between 2019 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

A New Dataflow Implementation to Improve Energy Efficiency of Monolithic 3D Systolic Arrays.

Prachi Shukla, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun

CoRR, 2024

2023

TREAD-M3D: Temperature-Aware DNN Accelerators for Monolithic 3-D Mobile Systems.

Prachi Shukla, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., December, 2023

Temperature-aware 3D-integrated systolic array DNN accelerators

Prachi Shukla

PhD thesis, 2023

Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads.

Prachi Shukla, Derrick Aguren, Tom Burd, Ayse K. Coskun, John Kalamatianos

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2023

2022

PACT: An Extensible Parallel Thermal Simulator for Emerging Integration and Cooling Technologies.

Zihao Yuan, Prachi Shukla, Sofiane Chetoui, Sean S. Nemtzow, Sherief Reda, Ayse K. Coskun

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

Temperature-Aware Monolithic 3D DNN Accelerators for Biomedical Applications.

Prachi Shukla, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun

CoRR, 2022

2021

Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects.

Krithika Dhananjay, Prachi Shukla, Vasilis F. Pavlidis, Ayse K. Coskun, Emre Salman

IEEE Trans. Circuits Syst. II Express Briefs, 2021

Temperature-Aware Optimization of Monolithic 3D Deep Neural Network Accelerators.

Prachi Shukla, Sean S. Nemtzow, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun

Proceedings of the ASPDAC '21: 26th Asia and South Pacific Design Automation Conference, 2021

2020

A Learning-Based Thermal Simulation Framework for Emerging Two-Phase Cooling Technologies.

Zihao Yuan, Geoffrey Vaartstra, Prachi Shukla, Zhengmao Lu, Evelyn Wang, Sherief Reda, Ayse K. Coskun

Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition, 2020

2019

Modeling and Optimization of Chip Cooling with Two-Phase Vapor Chambers.

Zihao Yuan, Geoffrey Vaartstra, Prachi Shukla, Sherief Reda, Evelyn Wang, Ayse K. Coskun

Proceedings of the 2019 IEEE/ACM International Symposium on Low Power Electronics and Design, 2019

An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs.

Prachi Shukla, Ayse K. Coskun, Vasilis F. Pavlidis, Emre Salman

Proceedings of the 2019 on Great Lakes Symposium on VLSI, 2019