Pradeep Lall

Orcid: 0000-0002-4074-937X

According to our database1, Pradeep Lall authored at least 17 papers between 2007 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Awards

IEEE Fellow

IEEE Fellow 2012, "For contributions to reliability prediction for electronic packaging".

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2023
Estimation of SOH Degradation of Coin Cells Subjected to Accelerated Life Cycling with Randomized Cycling Depths and C-Rates.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2018
PHM of state-of-charge for flexible power sources in wearable electronics with EKF.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Prognostics health management of electronic systems - A reliability physics approach.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016
Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging.
Microelectron. Reliab., 2016

High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature.
Microelectron. Reliab., 2016

Prognostication of remaining useful-life for flexible batteries in foldable wearable electronics.
Proceedings of the IEEE International Conference on Prognostics and Health Management, 2016

ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments.
Proceedings of the IEEE International Conference on Prognostics and Health Management, 2016

2015
Reliability and Failure Modes of Solid-State Lighting Electrical Drivers Subjected to Accelerated Aging.
IEEE Access, 2015

Prognostication of LED remaining useful life and color stability in the presence of contamination.
Proceedings of the 2015 IEEE Conference on Prognostics and Health Management, 2015

Prognostication of solder-joint reliability of 0.4mm and 0.5mm pitch bgas subjected to mechanical shocks up to 10, 000G.
Proceedings of the 2015 IEEE Conference on Prognostics and Health Management, 2015

2012
Extended Kalman Filter Models and Resistance Spectroscopy for Prognostication and Health Monitoring of Leadfree Electronics Under Vibration.
IEEE Trans. Reliab., 2012

Decorrelated Feature Space and Neural Nets Based Framework for Failure Modes Clustering in Electronics Subjected to Mechanical Shock.
IEEE Trans. Reliab., 2012

Prognostics Health Management of Electronic Systems Under Mechanical Shock and Vibration Using Kalman Filter Models and Metrics.
IEEE Trans. Ind. Electron., 2012

2011
Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads.
IEEE Trans. Ind. Electron., 2011

Guest Editorial.
IEEE Trans. Ind. Electron., 2011

2009
Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads.
Microelectron. Reliab., 2009

2007
Feature extraction and damage-precursors for prognostication of lead-free electronics.
Microelectron. Reliab., 2007


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