Luu Nguyen

Orcid: 0000-0003-3347-4723

According to our database¹, Luu Nguyen authored at least 5 papers between 2004 and 2018.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Awards

IEEE Fellow

IEEE Fellow 2001, "For development of wafer scale packaging, and plastic packaging.".

Timeline

Legend:

Book

In proceedings

Article

PhD thesis

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Links

On csauthors.net:

Bibliography

2018

Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2018

2016

Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., 2016

ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments.

[BibT_eX]

[DOI]

Pradeep Lall

Shantanu Deshpande

Luu Nguyen

Proceedings of the IEEE International Conference on Prognostics and Health Management, 2016

2014

TCAD modeling of encapsulation layer in high-voltage, high-temperature operation regime.

[BibT_eX]

[DOI]

Proceedings of the 44th European Solid State Device Research Conference, 2014

2004

Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2004

Luu Nguyen

Awards

IEEE Fellow

Timeline

Legend:

Links

On csauthors.net:

Bibliography

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