Luu Nguyen
Orcid: 0000-0003-3347-4723
According to our database1,
Luu Nguyen
authored at least 5 papers
between 2004 and 2018.
Collaborative distances:
Collaborative distances:
Awards
IEEE Fellow
IEEE Fellow 2001, "For development of wafer scale packaging, and plastic packaging.".
Timeline
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2018
Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture.
Microelectron. Reliab., 2018
2016
Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization.
IEEE Trans. Ind. Electron., 2016
ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments.
Proceedings of the IEEE International Conference on Prognostics and Health Management, 2016
2014
TCAD modeling of encapsulation layer in high-voltage, high-temperature operation regime.
Proceedings of the 44th European Solid State Device Research Conference, 2014
2004
Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages.
Microelectron. Reliab., 2004