Quoc Phan

According to our database, Quoc Phan authored at least 2 papers between 2024 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

DFT Techniques For Efficient 3D IC Interconnect Test For Chiplet and Multi-Die Package.

Anshuman Chandra, Chi-Chun Yang, Quoc Phan, Martin Keim

Proceedings of the IEEE European Test Symposium, 2025

2024

Physical-Aware Interconnect Test for Multi-Die Systems Using 3Dblox Open Standard.

Sandeep Kumar Goel, Ankita Patidar, Moiz Khan, Frank Lee, Anshuman Chandra, Martin Keim, Naim Lemar, Jonathan Gaudet, Quoc Phan, Vidya Neerkundar

Proceedings of the IEEE International Test Conference, 2024