Raul Mrossko

According to our database, Raul Mrossko authored at least 3 papers between 2009 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

Stress impact of moisture diffusion measured with the stress chip.

F. Schindler-Saefkow, F. Rost, Alexander Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, J. Keller

Microelectron. Reliab., 2014

2013

Effect of moisture swelling on MEMS packaging and integrated sensors.

J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel

Microelectron. Reliab., 2013

2009

3-D thin chip integration technology - from technology development to application.

Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl

Proceedings of the IEEE International Conference on 3D System Integration, 2009