Ray Tzeng

According to our database, Ray Tzeng authored at least 2 papers between 2017 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

A 5nm 3.4GHz Tri-Gear ARMv9 CPU Subsystem in a Fully Integrated 5G Flagship Mobile SoC.

Ashish Nayak, HsinChen Chen, Hugh Mair, Rolf Lagerquist, Tao Chen, Anand Rajagopalan, Gordon Gammie, Ramu Madhavaram, Madhur Jagota, C. J. Chung, Jenny Wiedemeier, Bala Meera, Chao-Yang Yeh, Maverick Lin, Curtis Lin, Vincent Lin, Jiun Lin, Y. S. Chen, Barry Chen, Cheng-Yuh Wu, Ryan ChangChien, Ray Tzeng, Kelvin Yang, Achuta Thippana, Ericbill Wang, Shih-Arn Hwang

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2017

3.4 A 10nm FinFET 2.8GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance.

Hugh Mair, Ericbill Wang, Alice Wang, Ping Kao, Yuwen Tsai, Sumanth Gururajarao, Rolf Lagerquist, Jin Son, Gordon Gammie, Gordon Lin, Achuta Thippana, Kent Li, Manzur Rahman, Wuan Kuo, David Yen, Yi-Chang Zhuang, Ue Fu, Hung-Wei Wang, Mark Peng, Cheng-Yuh Wu, Taner Dosluoglu, Anatoly Gelman, Daniel Dia, Girishankar Gurumurthy, Tony Hsieh, W. X. Lin, Ray Tzeng, Jengding Wu, C. H. Wang, Uming Ko

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017