Achuta Thippana

According to our database, Achuta Thippana authored at least 6 papers between 2016 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

2.1 A 4nm 3.4GHz Tri-Gear Fully Out-of-Order ARMv9.2 CPU Subsystem-Based 5G Mobile SoC.

Anshul Varma, Sumanth Gururajarao, HsinChen Chen, Tao Chen, Gordon Gammie, Hugh Mair, Jen-Hang Yang, Hao-Hsiang Yu, Shun-Chieh Chang, Cheng-Hao Yang, Li-An Huang, Kumar Ramanathan, Ramesh Halli, Efron Ho, Ta-Wen Hung, Sung S.-Y. Hsueh, LiangChe Li, Achuta Thippana, Ericbill Wang, Sa Hwang

Proceedings of the IEEE International Solid-State Circuits Conference, 2024

2022

A 5nm 3.4GHz Tri-Gear ARMv9 CPU Subsystem in a Fully Integrated 5G Flagship Mobile SoC.

Ashish Nayak, HsinChen Chen, Hugh Mair, Rolf Lagerquist, Tao Chen, Anand Rajagopalan, Gordon Gammie, Ramu Madhavaram, Madhur Jagota, C. J. Chung, Jenny Wiedemeier, Bala Meera, Chao-Yang Yeh, Maverick Lin, Curtis Lin, Vincent Lin, Jiun Lin, Y. S. Chen, Barry Chen, Cheng-Yuh Wu, Ryan ChangChien, Ray Tzeng, Kelvin Yang, Achuta Thippana, Ericbill Wang, Shih-Arn Hwang

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2021

A 7nm 5G Mobile SoC Featuring a 3.0GHz Tri-Gear Application Processor Subsystem.

HsinChen Chen, Rolf Lagerquist, Ashish Nayak, Hugh Mair, Gokulakrishnan Manoharan, Ericbill Wang, Gordon Gammie, Efron Ho, Anand Rajagopalan, Lee-Kee Yong, Ramu Madhavaram, Madhur Jagota, Chi-Jui Chung, Sudhakar Maruthi, Jenny Wiedemeier, Tao Chen, Henry Hsieh, Daniel Dia, Amjad Sikiligiri, Manzur Rahman, Barry Chen, Curtis Lin, Vincent Lin, Elly Chiang, Cheng-Yuh Wu, Po-Yang Hsu, Jason Tsai, Wade Wu, Achuta Thippana, S. A. Huang

Proceedings of the IEEE International Solid-State Circuits Conference, 2021

2020

2.5 A 7nm FinFET 2.5GHz/2.0GHz Dual-Gear Octa-Core CPU Subsystem with Power/Performance Enhancements for a Fully Integrated 5G Smartphone SoC.

Hugh Mair, Ericbill Wang, Ashish Nayak, Rolf Lagerquist, Loda Chou, Gordon Gammie, HsinChen Chen, Lee-Kee Yong, Manzur Rahman, Jenny Wiedemeier, Ramu Madhavaram, Alex Chiou, Blundt Li, Vincent Lin, Rory Huang, Michael Yanq, Achuta Thippana, Osric Su, S. A. Huang

Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

2017

3.4 A 10nm FinFET 2.8GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance.

Hugh Mair, Ericbill Wang, Alice Wang, Ping Kao, Yuwen Tsai, Sumanth Gururajarao, Rolf Lagerquist, Jin Son, Gordon Gammie, Gordon Lin, Achuta Thippana, Kent Li, Manzur Rahman, Wuan Kuo, David Yen, Yi-Chang Zhuang, Ue Fu, Hung-Wei Wang, Mark Peng, Cheng-Yuh Wu, Taner Dosluoglu, Anatoly Gelman, Daniel Dia, Girishankar Gurumurthy, Tony Hsieh, W. X. Lin, Ray Tzeng, Jengding Wu, C. H. Wang, Uming Ko

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

2016

4.3 A 20nm 2.5GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance.

Hugh Mair, Gordon Gammie, Alice Wang, Rolf Lagerquist, C. J. Chung, Sumanth Gururajarao, Ping Kao, Anand Rajagopalan, Anirban Saha, Amit Jain, Ericbill Wang, Shichin Ouyang, Huajun Wen, Achuta Thippana, HsinChen Chen, Syed Rahman, Minh Chau, Anshul Varma, Brian Flachs, Mark Peng, Alfred Tsai, Vincent Lin, Ue Fu, Wuan Kuo, Lee-Kee Yong, Clavin Peng, Leo Shieh, Jengding Wu, Uming Ko

Proceedings of the 2016 IEEE International Solid-State Circuits Conference, 2016