Reinhard Pufall
According to our database1,
Reinhard Pufall
authored at least 12 papers
between 2004 and 2014.
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Bibliography
2014
Microelectron. Reliab., 2014
2012
Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests.
Microelectron. Reliab., 2012
Determination of adhesion and delamination prediction for semiconductor packages by using Grey Scale Correlation and Cohesive Zone Modelling.
Microelectron. Reliab., 2012
Studies on the reliability of power packages based on strength and fracture criteria.
Microelectron. Reliab., 2012
2010
New aspects in characterization of adhesion of moulding compounds on different surfaces by using a simple button-shear-test method for lifetime prediction of power devices.
Microelectron. Reliab., 2010
2008
Reduction of test effort. Looking for more acceleration for reliable components for automotive applications.
Microelectron. Reliab., 2008
New aspects for lifetime prediction of bipolar transistors in automotive power wafer technologies by using a power law fitting procedure.
Microelectron. Reliab., 2008
NBTI on smart power technologies: A detailed analysis of two concurrent effects using a re-examined on-the-fly technique.
Microelectron. Reliab., 2008
2007
Analysis of ESD protection structure behaviour after ageing as new approach for system level reliability of automotive power devices.
Microelectron. Reliab., 2007
Exceptional operative gate voltage induces negative bias temperature instability (NBTI) on n-type trench DMOS transistors.
Microelectron. Reliab., 2007
2006
ESD protection structure qualification - a new approach for release for automotive applications.
Microelectron. Reliab., 2006
2004
Semiconductors in high temperature applications - a future trend in automotive industry.
Microelectron. Reliab., 2004