Sehoon Yoo

According to our database, Sehoon Yoo authored at least 6 papers between 2011 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Advanced novel optical stack technologies for high SNR in CMOS Image Sensor.

Hye Yeon Park, Yunki Lee, Jonghoon Park, Hyunseok Song, Taesung Lee, Hyung Keun Gweon, Yunji Jung, Jeongmin Bae, Boseong Kim, Junwon Han, Seungwon Kim, Cheolsang Yoon, Jeongki Kim, Changkeun Lee, Sehoon Yoo, Euiyeol Kim, Hyunmin Baek, Howoo Park, Bumsuk Kim, JungChak Ahn, Joonseo Yim

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2020

A 1280×960 Dynamic Vision Sensor with a 4.95-μm Pixel Pitch and Motion Artifact Minimization.

Yunjae Suh, Seungnam Choi, Masamichi Ito, Jeongseok Kim, Youngho Lee, Jongseok Seo, Heejae Jung, Dong-Hee Yeo, Seol Namgung, Jongwoo Bong, Sehoon Yoo, Seung-Hun Shin, Doowon Kwon, Pilkyu Kang, Seokho Kim, Hoonjoo Na, Kihyun Hwang, Chang-Woo Shin, Jun-Seok Kim, Paul K. J. Park, Joonseok Kim, Hyunsurk Ryu, Yongin Park

Proceedings of the IEEE International Symposium on Circuits and Systems, 2020

2017

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications.

Byung-Suk Lee, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee, Sehoon Yoo, Jun-Ki Kim, Jeong-Won Yoon

Microelectron. Reliab., 2017

2012

Multi-function unit for LED lighting.

Sehoon Yoo, Sehyun Song, Kichul Kim, Chanwoo Park, Jungchul Gong

Proceedings of the International SoC Design Conference, 2012

2011

Advanced TSV filling method with Sn alloy and its reliability.

Young-Ki Ko, Myong-Suk Kang, Hiroyuki Kokawa, Yutaka S. Sato, Sehoon Yoo, Chang-Woo Lee

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC.

Won-Myoung Ki, Myong-Suk Kang, Sehoon Yoo, Chang-Woo Lee

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011