Sheng Lin

Affiliations:
  • Northeastern University, Department of Electrical and Computer Engineering, Boston, MA, USA
  • National High-Performance IC Design Center, Shanghai, China (2004-2007)
  • Zhejiang University, Department of electrical engineering, Hangzhou, China (former)


According to our database1, Sheng Lin authored at least 7 papers between 2008 and 2011.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2011
A 11-Transistor Nanoscale CMOS Memory Cell for Hardening to Soft Errors.
IEEE Trans. Very Large Scale Integr. Syst., 2011

Modeling and design of a nanoscale memory cell for hardening to a single event with multiple node upset.
Proceedings of the IEEE 29th International Conference on Computer Design, 2011

2010
Design and analysis of a 32 nm PVT tolerant CMOS SRAM cell for low leakage and high stability.
Integr., 2010

Read-out schemes for a CNTFET-based crossbar memory.
Proceedings of the 20th ACM Great Lakes Symposium on VLSI 2009, 2010

2009
Soft-Error Hardening Designs of Nanoscale CMOS Latches.
Proceedings of the 27th IEEE VLSI Test Symposium, 2009

A Novel Hardened Design of a CMOS Memory Cell at 32nm.
Proceedings of the 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, 2009

2008
A low leakage 9t sram cell for ultra-low power operation.
Proceedings of the 18th ACM Great Lakes Symposium on VLSI 2008, 2008


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