Shun'ichiro Ohmi

According to our database1, Shun'ichiro Ohmi authored at least 54 papers between 2002 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Bibliography

2023
Kr-Plasma Sputtering for Pt Gate Electrode Deposition on MFSFET with 5 nm-Thick Ferroelectric Nondoped HfO<sub>2</sub> Gate Insulator for Analog Memory Application.
IEICE Trans. Electron., October, 2023

Foreword.
IEICE Trans. Electron., October, 2023

Precise VTH Control of MFSFET with 5 nm-thick FeND-HfO2 Realized by Kr-Plasma Sputtering for Pt Gate Electrode Deposition.
Proceedings of the Device Research Conference, 2023

2022
The Effect of Inter Layers on the Ferroelectric Undoped HfO<sub>2</sub> Formation.
IEICE Trans. Electron., October, 2022

MFSFET with 5nm Thick Ferroelectric Nondoped HfO<sub>2</sub> Gate Insulator Utilizing Low Power Sputtering for Pt Gate Electrode Deposition.
IEICE Trans. Electron., October, 2022

Sputtering Gas Pressure Dependence on the LaB<sub>x</sub>N<sub>y</sub> Insulator Formation for Pentacene-Based Back-Gate Type Floating-Gate Memory with an Amorphous Rubrene Passivation Layer.
IEICE Trans. Electron., October, 2022

Ultrathin Ferroelectric Nondoped HfO2 for MFSFET with High-speed and Low-voltage Operation.
Proceedings of the Device Research Conference, 2022

MFSFET with Ferroelectric HfN for Analog Memory Application.
Proceedings of the Device Research Conference, 2022

2021
MFSFET with 5 nm Thick Ferroelectric Undoped HfO2 Gate Insulator.
Proceedings of the Device Research Conference, 2021

Ferroelectric Nondoped HfO2 Blocking Layer Formation for Hf-based FeNOS Analog Memory Applications.
Proceedings of the Device Research Conference, 2021

2020
The Influence of High-Temperature Sputtering on the N-Doped LaB<sub>6</sub> Thin Film Formation Utilizing RF Sputtering.
IEICE Trans. Electron., 2020

<i>In-Situ</i> N<sub>2</sub>-Plasma Nitridation for High-k HfN Gate Insulator Formed by Electron Cyclotron Resonance Plasma Sputtering.
IEICE Trans. Electron., 2020

The Evaluation of the Interface Properties of PdEr-Silicide on Si(100) Formed with TiN Encapsulating Layer and Dopant Segregation Process.
IEICE Trans. Electron., 2020

Ferroelectric Gate Field-Effect Transistors with 10nm Thick Nondoped HfO<sub>2</sub> Utilizing Pt Gate Electrodes.
IEICE Trans. Electron., 2020

High-k LaBxNy gate insulator formed by the Ar/N2 plasma sputtering of N-doped LaB6 metal thin films and its application to floating-gate memory.
Proceedings of the 2020 Device Research Conference, 2020

Low-Voltage Operation of MFSFET with Ferroelectric Nondoped HfO2 Formed by Kr/O2-Plasma Sputtering.
Proceedings of the 2020 Device Research Conference, 2020

2019
The Effect of Kr/O<sub>2</sub> Sputtering on the Ferroelectric Properties of SrBi<sub>2</sub>Ta<sub>2</sub>O<sub>9</sub> Thin Film Formation.
IEICE Trans. Electron., 2019

Etching Control of HfN Encapsulating Layer for PtHf-Silicide Formation with Dopant Segregation Process.
IEICE Trans. Electron., 2019

AuGe-Alloy Source and Drain Formation by the Lift-Off Process for the Scaling of Bottom-Contact Type Pentacene-Based OFETs.
IEICE Trans. Electron., 2019

Low Temperature Formation of Pd<sub>2</sub>Si with TiN Encapsulating Layer and Its Application to Dopant Segregation Process.
IEICE Trans. Electron., 2019

The Effect of PMA with TiN Gate Electrode on the Formation of Ferroelectric Undoped HfO<sub>2</sub> Directly Deposited on Si(100).
IEICE Trans. Electron., 2019

Ultrathin HfN Multilayer Gate Insulator Formation with High Dielectric Constant Induced by Interface Polarization.
Proceedings of the Device Research Conference, 2019

2018
PdEr-Silicide Formation and Contact Resistivity Reduction to n-Si(100) Realized by Dopant Segregation Process.
IEICE Trans. Electron., 2018

Electron Injection of N-type Pentacene-Based OFET with Nitrogen-Doped LaB<sub>6</sub> Bottom-Contact Electrodes.
IEICE Trans. Electron., 2018

Improvement of Endurance Characteristics for Al-Gate Hf-Based MONOS Structures on Atomically Flat Si(100) Surface Realized by Annealing in Ar/H<sub>2</sub> Ambient.
IEICE Trans. Electron., 2018

Multi-level 2-bit/cell operation utilizing Hf-based MONOS nonvolatile memory.
Proceedings of the 76th Device Research Conference, 2018

2017
PdYb-Silicide with Low Schottky Barrier Height to n-Si Formed from Pd/Yb/Si(100) Stacked Structures.
IEICE Trans. Electron., 2017

Effect of Nitrogen-Doped LaB<sub>6</sub> Interfacial Layer on Device Characteristics of Pentacene-Based OFET.
IEICE Trans. Electron., 2017

2016
PtHf Silicide Formation Utilizing PtHf-Alloy Target for Low Contact Resistivity.
IEICE Trans. Electron., 2016

High Quality Pentacene Film Formation on N-Doped LaB<sub>6</sub> Donor Layer.
IEICE Trans. Electron., 2016

A Study on Substrate Orientation Dependence of Si Surface Flattening Process by Sacrificial Oxidation and Its Effect on MIS Diode Characteristics.
IEICE Trans. Electron., 2016

Investigation of bilayer HfN<sub>x</sub> gate insulator utilizing ECR plasma sputtering.
IEICE Electron. Express, 2016

2015
A Study on Si(100) Surface Flattening Utilizing Sacrificial Oxidation Process and Its Effect on MIS Diode Characteristics.
IEICE Trans. Electron., 2015

In-situ formation of Hf-based MONOS structures for non-volatile memory applications.
IEICE Electron. Express, 2015

2014
Influence of Si Surface Roughness on Electrical Characteristics of MOSFET with HfON Gate Insulator Formed by ECR Plasma Sputtering.
IEICE Trans. Electron., 2014

Experimental demonstration of a ferroelectric FET using paper substrate.
IEICE Electron. Express, 2014

Importance of Si surface flatness to realize high-performance Si devices utilizing ultrathin films with new material system.
IEICE Electron. Express, 2014

2013
Flattening Process of Si Surface below 1000°C Utilizing Ar/4.9%H<sub>2</sub> Annealing and Its Effect on Ultrathin HfON Gate Insulator Formation.
IEICE Trans. Electron., 2013

Contact resistivity reduction for PtSi/Si(100) by dopant segregation process.
IEICE Electron. Express, 2013

Impact of Si surface roughness on MOSFET characteristics with ultrathin HfON gate insulator formed by ECR plasma sputtering.
IEICE Electron. Express, 2013

2012
Growth Mechanism of Pentacene on HfON Gate Insulator and Its Effect on Electrical Properties of Organic Field-Effect Transistors.
IEICE Trans. Electron., 2012

Hafnium-nitride gate insulator formed by electron-cyclotron-resonance plasma sputtering.
IEICE Electron. Express, 2012

2011
Investigation of n-Type Pentacene Based MOS Diodes with Ultra-Thin Metal Interface Layer.
IEICE Trans. Electron., 2011

Modulation of PtSi Work Function by Alloying with Low Work Function Metal.
IEICE Trans. Electron., 2011

Selective etching of HfN gate electrode for HfN/HfSiON gate stack in-situ formations.
IEICE Electron. Express, 2011

Low contact resistivity of barrier height controlled PtHfSi to Si evaluated by cross-bridge Kelvin resistor.
IEICE Electron. Express, 2011

Performance improvement of pentacene based organic field-effect transistor with HfON gate insulator.
IEICE Electron. Express, 2011

Work function modulation of PtSi by alloying with Yb.
IEICE Electron. Express, 2011

A study on precise control of PtSi work function by alloying with Hf.
IEICE Electron. Express, 2011

2007
A Proposal of TC-MOSFET and Fabrication Process of Twin Si Channels.
IEICE Trans. Electron., 2007

2006
Ultrathin HfO<sub>x</sub>N<sub>y</sub> Gate Insulator Formation by Electron Cyclotron Resonance Ar/N<sub>2</sub> Plasma Nitridation of HfO<sub>2</sub> Thin Films.
IEICE Trans. Electron., 2006

2005
Electrical properties of vacuum annealed La<sub>2</sub>O<sub>3</sub> thin films grown by E-beam evaporation.
Microelectron. J., 2005

Separation by Bonding Si Islands (SBSI) for Advanced CMOS LSI Applications.
IEICE Trans. Electron., 2005

2002
Silicon integrated circuit technology from past to future.
Microelectron. Reliab., 2002


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