Siyang Liu

Orcid: 0000-0001-6498-9901

Affiliations:
  • Southeast University, National ASIC System Engineering Research Center, Nanjing, China (PhD 2015)


According to our database1, Siyang Liu authored at least 16 papers between 2010 and 2026.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2026
A Zero-Voltage Switching Buck Converter With Enhanced Efficiency Over a Wide Load Range.
IEEE J. Solid State Circuits, May, 2026

A novel trench SiC MOSFET with an integrated double-JFET enabling enhanced reverse conduction path.
Microelectron. J., 2026

2025
Substrate bias effects in p-channel GaN-on-Si transistors.
Sci. China Inf. Sci., 2025

2024
An Adjustable Gate Driver Based on the Optimization of Switching Transient Performances.
IEEE Access, 2024

High Sensitivity Lateral Hall Device in Silicon on Insulator (SOI) Platform.
Proceedings of the 2024 IEEE SENSORS, Kobe, Japan, October 20-23, 2024, 2024

A Rugged 1200V P-channel LDMOS in Bipolar-CMOS-DMOS Process with Global Potential Control Technology.
Proceedings of the IEEE International Conference on Integrated Circuits, 2024

2023
Superior Performances of Dynamic On-State Resistance in 1.9kV GaN-on-Sapphire HEMT.
Proceedings of the IEEE International Conference on Integrated Circuits, 2023

2022
Comparison Investigations on Unclamped-Inductive-Switching Behaviors of Power GaN Switching Devices.
IEEE Trans. Ind. Electron., 2022

2021
Lightning Surge Robustness Analysis and Optimization for an LED Driver Based on a Flyback Converter.
IEEE Trans. Ind. Electron., 2021

Novel Multiple-Layer Stack Capacitor and Its Application in the IRPFA Readout Circuit.
IEEE Access, 2021

33.2 A 600V GaN Active Gate Driver with Dynamic Feedback Delay Compensation Technique Achieving 22.5% Turn-On Energy Saving.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021

Design of 320×256-30um DI Medium and Short Wave Two-color IRFPA Readout Circuit.
Proceedings of the 5th International Conference on Vision, Image and Signal Processing, 2021

2015
A novel stack package solution of AC-DC chip for high-power density adapters.
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015

2014
A lateral DMOS with partial buried-oxide layer to achieve better RESURF effect.
IEICE Electron. Express, 2014

2011
Threshold voltage degradation under high Vgs and low Vds on 200 V SOI power devices.
Microelectron. J., 2011

2010
Devices' optimization against hot-carrier degradation in high voltage pLEDMOS transistor.
Microelectron. Reliab., 2010


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