Subed Lamichhane

According to our database, Subed Lamichhane authored at least 10 papers between 2020 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

EMSpice 2.1: A Coupled EM and IR Drop Analysis Tool with Joule Heating and Thermal Map Integration for VLSI Reliability.

Subed Lamichhane, Haotian Lu, Sheldon X.-D. Tan

CoRR, July, 2025

BPINN-EM-Post: Stochastic Electromigration Damage Analysis in the Post-Void Phase based on Bayesian Physics-Informed Neural Network.

Subed Lamichhane, Haotian Lu, Sheldon X.-D. Tan

CoRR, March, 2025

EMSpice 2.1: A Coupled EM and IR Drop Analysis Tool with Joule Heating and Thermal Mapb Integration for VLSI Reliability.

Subed Lamichhane, Haotian Lu, Sheldon X.-D. Tan

Proceedings of the 21st International Conference on Synthesis, 2025

2024

EMspice 2.0: Multiphysics Electromigration Analysis Tool for Beyond Moore ICs.

Subed Lamichhane, Mohammadamir Kavousi, Sheldon X.-D. Tan

Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2024

BPINN-EM: Fast Stochastic Analysis of Electromigration Damage using Bayesian Physics-Informed Neural Networks.

Subed Lamichhane, Mohammadamir Kavousi, Sheldon X.-D. Tan

Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024

2023

Linear Time Electromigration Analysis Based on Physics-Informed Sparse Regression.

Liang Chen, Wentian Jin, Mohammadamir Kavousi, Subed Lamichhane, Sheldon X.-D. Tan

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., November, 2023

PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks.

Subed Lamichhane, Wentian Jin, Liang Chen, Mohammadamir Kavousi, Sheldon X.-D. Tan

Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023

2022

HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network.

Wentian Jin, Liang Chen, Subed Lamichhane, Mohammadamir Kavousi, Sheldon X.-D. Tan

Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, 2022

2021

Fast Electrostatic Analysis For VLSI Aging based on Generative Learning.

Subed Lamichhane, Shaoyi Peng, Wentian Jin, Sheldon X.-D. Tan

Proceedings of the 3rd ACM/IEEE Workshop on Machine Learning for CAD, 2021

2020

Coupling Noise Mitigation using a Pass Transistor.

Selahattin Sayil, Subed Lamichhane, Kutay Sayil

Proceedings of the 2020 IEEE Computer Society Annual Symposium on VLSI, 2020