Sung Yi

According to our database, Sung Yi authored at least 5 papers between 2003 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

Predicted thermal stresses in a TSV design.

Ephraim Suhir, Sung Yi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2011

Integrated analysis of the heterogeneous microarray data.

Sung Yi, Taesung Park

BMC Bioinform., 2011

2008

Thermal transient characteristics of die attach in high power LED PKG.

Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Young-Ki Lee, Seok-Moon Choi, Sung Yi

Microelectron. Reliab., 2008

2006

An optical characterization technique for hygroscopic expansion of polymers and plastic packages.

Fei Su, Kerm Sin Chian, Sung Yi

Microelectron. Reliab., 2006

2003

Prediction and verification of process induced warpage of electronic packages.

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi

Microelectron. Reliab., 2003