Thibault P. Delhaye

Affiliations:
  • UC Louvain, ICTEAM Institute, Louvain-la-Neuve, Belgium


According to our database1, Thibault P. Delhaye authored at least 5 papers between 2017 and 2022.

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Bibliography

2022
The environmental footprint of integrated circuits (IC): supporting a review with data.
Dataset, November, 2022

The Environmental Footprint of IC Production: Meta-Analysis and Historical Trends.
Proceedings of the 52nd IEEE European Solid-State Device Research Conference, 2022

2021
Improving MOSFET Piezoresistive Strain Gauges Limit of Detection Using Lock-In Principle.
Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021

2020
Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB.
Proceedings of the 2020 IEEE Sensors, Rotterdam, The Netherlands, October 25-28, 2020, 2020

2017
High-efficiency wireless power transfer for mm-size biomedical implants.
Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017


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