Ting-Yuan Wang

Orcid: 0000-0002-2648-9532

According to our database1, Ting-Yuan Wang authored at least 16 papers between 2002 and 2020.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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Links

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Bibliography

2020
Diverse Community Structures in the Neuronal-Level Connectome of the Drosophila Brain.
Neuroinformatics, 2020

Anomalous Behaviors Detection for Underwater Fish Using AI Techniques.
IEEE Access, 2020

2018
Kaleido: Visualizing Big Brain Data with Automatic Color Assignment for Single-Neuron Images.
Neuroinformatics, 2018

Soma Detection in 3D Images of Neurons using Machine Learning Technique.
Neuroinformatics, 2018

2009
Incorporating structural characteristics for identification of protein methylation sites.
J. Comput. Chem., 2009

Incorporating support vector machine for identifying protein tyrosine sulfation sites.
J. Comput. Chem., 2009

2007
KinasePhos 2.0: a web server for identifying protein kinase-specific phosphorylation sites based on sequences and coupling patterns.
Nucleic Acids Res., 2007

2004
Multiple channel programmable timing generators with single cyclic delay line.
IEEE Trans. Instrum. Meas., 2004

SPICE-Compatible Thermal Simulation with Lumped Circuit Modeling for Thermal Reliability Analysis Based on Modeling Order Reduction.
Proceedings of the 5th International Symposium on Quality of Electronic Design (ISQED 2004), 2004

Sensitivity guided net weighting for placement driven synthesis.
Proceedings of the 2004 International Symposium on Physical Design, 2004

Thermal and Power Integrity Based Power/Ground Networks Optimization.
Proceedings of the 2004 Design, 2004

2003
Thermal-ADI - a linear-time chip-level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method.
IEEE Trans. Very Large Scale Integr. Syst., 2003

A Scalable Core Migration Protocol for Dynamic Multicast Tree.
J. Inf. Sci. Eng., 2003

3D thermal-ADI: an efficient chip-level transient thermal simulator.
Proceedings of the 2003 International Symposium on Physical Design, 2003

2002
3-D Thermal-ADI: a linear-time chip level transient thermal simulator.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2002

Optimization of the Power/Ground Network Wire-Sizing and Spacing Based on Sequential Network Simplex Algorithm.
Proceedings of the 3rd International Symposium on Quality of Electronic Design, 2002


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