Tsung-Yao Lin

According to our database, Tsung-Yao Lin authored at least 6 papers between 2014 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Engine for High-Resolution Visual-Quality Enhancement on Smart Devices.

Ming-En Shih, Shih-Wei Hsieh, Ping-Yuan Tsai, Ming-Hung Lin, Pei-Kuei Tsung, En-Jui Chang, Jenwei Liang, Shu-Hsin Chang, Chung-Lun Huang, You-Yu Nian, Zhe Wan, Sushil Kumar, Cheng-Xin Xue, Gajanan Jedhe, Hidehiro Fujiwara, Haruki Mori, Chih-Wei Chen, Po-Hua Huang, Chih-Feng Juan, Chung-Yi Chen, Tsung-Yao Lin, Ch Wang, Chih-Cheng Chen, Kevin Jou

Proceedings of the IEEE International Solid-State Circuits Conference, 2024

2023

A 12-nm 0.62-1.61 mW Ultra-Low Power Digital CIM-based Deep-Learning System for End-to-End Always-on Vision.

En-Jui Chang, Cheng-Xin Xue, Chetan Deshpande, Gajanan Jedhe, Jenwei Liang, Chih-Chung Cheng, Hung-Wei Lin, Chia-Da Lee, Sushil Kumar, Kim Soon Jway, Zijie Guo, Ritesh Garg, Allen-Cl Lu, Chien-Hung Lin, Meng-Han Hsieh, Tsung-Yao Lin, Chih-Cheng Chen

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2020

7.1 A 3.4-to-13.3TOPS/W 3.6TOPS Dual-Core Deep-Learning Accelerator for Versatile AI Applications in 7nm 5G Smartphone SoC.

Chien-Hung Lin, Chih-Chung Cheng, Yi-Min Tsai, Sheng-Je Hung, Yu-Ting Kuo, Perry H. Wang, Pei-Kuei Tsung, Jeng-Yun Hsu, Wei-Chih Lai, Chia-Hung Liu, Shao-Yu Wang, Chin-Hua Kuo, Chih-Yu Chang, Ming-Hsien Lee, Tsung-Yao Lin, Chih-Cheng Chen

Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

Developing a Model to Explore Consumer Buying Behaviors through Long Short-Term Memory.

Yueh-Shiu Lee, I-Yun Chen, Tsung-Yao Lin, Yen-Chiao Chuang, Hsu-Jung Liu

Proceedings of the ACM ICEA '20: 2020 ACM International Conference on Intelligent Computing and its Emerging Applications, GangWon Republic of Korea, December 12, 2020

2016

Helio X20: The first tri-gear mobile SoC with CorePilot™ 3.0 technology.

Tsung-Yao Lin, Ming-Hsien Lee, Loda Chou, Clavin Peng, Jih-Ming Hsu, Jia-Ming Chen, John-CC Chen, Alex Chiou, Artis Chiu, David Lee, Carrie Huang, Kenny Lee, TzuHeng Wang, Wei-Ting Wang, Yenchi Lee, Chi-Hui Wang, Pao-Ching Tseng, Ryan Chen, Kevin Jou

Proceedings of the 2016 IEEE Hot Chips 28 Symposium (HCS), 2016

2014

10.3 heterogeneous multi-processing quad-core CPU and dual-GPU design for optimal performance, power, and thermal tradeoffs in a 28nm mobile application processor.

Alice Wang, Tsung-Yao Lin, Shichin Ouyang, Wei-Hung Huang, Jidong Wang, Shu-Hsin Chang, Sheng-Ping Chen, Chun-Hsiung Hu, J. C. Tai, Koan-Sin Tan, Meng-Nan Tsou, Ming-Hsien Lee, Gordon Gammie, Chi-Wei Yang, Chih-Chieh Yang, Yeh-Chi Chou, Shih-Hung Lin, Wuan Kuo, Chi-Jui Chung, Lee-Kee Yong, Chia-Wei Wang, Kin Hooi Dia, Cheng-Hsing Chien, You-Ming Tsao, N. K. Singh, Rolf Lagerquist, Chih-Cheng Chen, Uming Ko

Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014