Werner Frammelsberger

According to our database, Werner Frammelsberger authored at least 7 papers between 2003 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

Protective nanometer films for reliable Cu-Cu connections.

Tobias Berthold, Guenther Benstetter, Werner Frammelsberger, Manuel Bogner, Rosana Rodríguez, Montserrat Nafría

Microelectron. Reliab., 2017

2007

Influence of the manufacturing process on the electrical properties of thin (k stacks observed with CAFM.

Mario Lanza, Marc Porti, Montserrat Nafría, Guenther Benstetter, Werner Frammelsberger, Heiko Ranzinger, E. Lodermeier, G. Jaschke

Microelectron. Reliab., 2007

2006

Kelvin probe force microscopy - An appropriate tool for the electrical characterisation of LED heterostructures.

Werner Bergbauer, Thomas Lutz, Werner Frammelsberger, Guenther Benstetter

Microelectron. Reliab., 2006

2005

Intermittent contact scanning capacitance microscopy-An improved method for 2D doping profiling.

Peter Breitschopf, Guenther Benstetter, Bernhard Knoll, Werner Frammelsberger

Microelectron. Reliab., 2005

2004

New trends in the application of Scanning Probe Techniques in Failure Analysis.

Thomas Schweinböck, S. Schömann, D. Álvarez, Marco Buzzo, Werner Frammelsberger, Peter Breitschopf, Günther Benstetter

Microelectron. Reliab., 2004

AFM-based scanning capacitance techniques for deep sub-micron semiconductor failure analysis.

Günther Benstetter, Peter Breitschopf, Werner Frammelsberger, Heiko Ranzinger, Peter Reislhuber, Thomas Schweinböck

Microelectron. Reliab., 2004

2003

Characterization of thin and ultra-thin SiO₂ films and SiO₂/Si interfaces with combined conducting and topographic atomic force microscopy.

Werner Frammelsberger, Guenther Benstetter, Thomas Schweinböck, Richard J. Stamp, Janice Kiely

Microelectron. Reliab., 2003