William Wahby

According to our database, William Wahby authored at least 6 papers between 2013 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Self-heating electrochemical memory for high-precision analog computing.

Adam L. Gross, Sangheon Oh, François Léonard, Wyatt Hodges, T. Patrick Xiao, Joshua D. Sugar, Jacklyn Zhu, Sritharini Radhakrishnan, Sangyong Lee, Jolie Wang, Adam S. Christensen, Sam Lilak, Patrick S. Finnegan, Patrick Crandall, Christopher H. Bennett, William Wahby, Robin Jacobs-Gedrim, Matthew J. Marinella, Suhas Kumar, Sapan Agarwal, Yiyang Li, A. Alec Talin, Elliot J. Fuller

CoRR, May, 2025

2024

A Discovery Platform to Characterize Emerging Nonvolatile Memories for Computing.

D. Wilson, Nad E. Gilbert, Matt Spear, J. Short, Christopher H. Bennett, William Wahby, Joshua E. Kim, Robin Jacobs-Gedrim, Tianyao Patrick Xiao, S. Agarwal, Matthew J. Marinella

Proceedings of the 42nd IEEE VLSI Test Symposium, 2024

2023

Statistical Characterization of ReRAM Arrays for Analog In-Memory Computing.

Jesse Short, Matthew Spear, Donald Wilson, William Wahby, T. Patrick Xiao, Robin Jacobs-Gedrim, Christopher H. Bennett, Nad Gilbert, Sapan Agarwal, Matthew J. Marinella

Proceedings of the IEEE International Conference on Rebooting Computing, 2023

2016

Design considerations for 2.5-D and 3-D integration accounting for thermal constraints.

Yang Zhang, Xuchen Zhang, William Wahby, Muhannad S. Bakir

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

The impact of 3D stacking on GPU-accelerated deep neural networks: An experimental study.

William Wahby, Thomas E. Sarvey, Hardik Sharma, Hadi Esmaeilzadeh, Muhannad S. Bakir

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2013

Evaluation of 3DICs and fabrication of monolithic interlayer vias.

William Wahby, Ashish Dembla, Muhannad S. Bakir

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013