Wiren Dale Becker

Orcid: 0000-0003-2266-3123

According to our database1, Wiren Dale Becker authored at least 9 papers between 1999 and 2019.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Awards

IEEE Fellow

IEEE Fellow 2015, "For contributions to power distribution and signal integrity in high-speed interconnects for computing systems".

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2019
A Hybrid Methodology for Jitter and Eye Estimation in High-Speed Serial Channels Using Polynomial Chaos Surrogate Models.
IEEE Access, 2019

2018
IBM POWER9 package technology and design.
IBM J. Res. Dev., 2018

Polynomial Chaos modeling for jitter estimation in high-speed links.
Proceedings of the IEEE International Test Conference, 2018

2015
Electronic packaging of the IBM z13 processor drawer.
IBM J. Res. Dev., 2015

2004
First- and second-level packaging of the z990 processor cage.
IBM J. Res. Dev., 2004

2002
A power, packaging, and cooling overview of the IBM eServer z900.
IBM J. Res. Dev., 2002

First- and second-level packaging for the IBM eServer z900.
IBM J. Res. Dev., 2002

Macromodeling of Digital I/O Ports for System EMC Assessment .
Proceedings of the 2002 Design, 2002

1999
MCM technology and design for the S/390 G5 system.
IBM J. Res. Dev., 1999


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