Thomas Strach

According to our database, Thomas Strach authored at least 16 papers between 2009 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

IBM Telum: a 16-Core 5+ GHz DCM.

Ofer Geva, Christopher J. Berry, Robert J. Sonnelitter, David Wolpert, Adam Collura, Thomas Strach, Di Phan, Cédric Lichtenau, Alper Buyuktosunoglu, Hubert Harrer, Jeffrey A. Zitz, Chad Marquart, Douglas Malone, Tobias Webel, Adam Jatkowski, John Isakson, Dina Hamid, Mark Cichanowski, Michael Romain, Faisal Hasan, Kevin Williams, Jesse Surprise, Chris Cavitt, Mark Cohen

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2020

Proactive power management in IBM z15.

Tobias Webel, Preetham M. Lobo, Thomas Strach, Pradeep Bhadravati Parashurama, Srinivas Purushotham, Ramon Bertran, Alper Buyuktosunoglu

IBM J. Res. Dev., 2020

2019

IBM z14: Processor Characterization and Power Management for High-Reliability Mainframe Systems.

Christopher J. Berry, David Wolpert, Christos Vezyrtzis, Richard F. Rizzolo, Sean M. Carey, Yaniv Maroz, Hunter F. Shi, Dureseti Chidambarrao, Christian Jacobi, Anthony Saporito, Thomas Strach, Alper Buyuktosunoglu, Preetham Lobo, Pierce Chuang, Pawel Owczarczyk, Ramon Bertran, Tobias Webel, Phillip J. Restle

IEEE J. Solid State Circuits, 2019

2018

IBM z14 design methodology enhancements in the 14-nm technology node.

Christopher J. Berry, James D. Warnock, John Badar, Dean G. Bair, Erwin Behnen, Brian Bell, Alper Buyuktosunoglu, Chris Cavitt, Pierce Chuang, Ofer Geva, Dina Hamid, John Isakson, Preetham Lobo, Frank Malgioglio, Guenter Mayer, José Luis Neves, Thomas Strach, Jesse Surprise, Christos Vezyrtzis, Tobias Webel, David Wolpert

IBM J. Res. Dev., 2018

Droop mitigation using critical-path sensors and an on-chip distributed power supply estimation engine in the z14™ enterprise processor.

Christos Vezyrtzis, Thomas Strach, Pierce I-Jen Chuang, Preetham Lobo, Richard F. Rizzolo, Tobias Webel, Pawel Owczarczyk, Alper Buyuktosunoglu, Ramon Bertran, David T. Hui, Susan M. Eickhoff, Michael S. Floyd, Gerard Salem, Sean M. Carey, Stelios G. Tsapepas, Phillip J. Restle

Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018

2017

26.2 Power supply noise in a 22nm z13™ microprocessor.

Pierce I-Jen Chuang, Christos Vezyrtzis, Divya Pathak, Richard F. Rizzolo, Tobias Webel, Thomas Strach, Otto A. Torreiter, Preetham Lobo, Alper Buyuktosunoglu, Ramon Bertran, Michael S. Floyd, Malcolm S. Ware, Gerard Salem, Sean M. Carey, Phillip J. Restle

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

2015

Robust power management in the IBM z13.

Tobias Webel, Preetham M. Lobo, Ramon Bertran, Gerard Salem, Malcolm Allen-Ware, Richard F. Rizzolo, Sean M. Carey, Thomas Strach, Alper Buyuktosunoglu, Charles Lefurgy, Pradip Bose, Ricardo Nigaglioni, Timothy J. Slegel, Michael S. Floyd, Brian W. Curran

IBM J. Res. Dev., 2015

IBM z13 circuit design and methodology.

James D. Warnock, Christopher J. Berry, Michael H. Wood, Leon J. Sigal, Yun-Chan Myung, Guenter Mayer, Mark D. Mayo, Y. Chan, Frank Malgioglio, Gerald Strevig, Charudhattan Nagarajan, Sean M. Carey, Gerard Salem, Friedrich Schroeder, Howard H. Smith, Di Phan, Ricardo Nigaglioni, Thomas Strach, Matthew M. Ziegler, Niels Fricke, K. Lind, José Neves, Sridhar H. Rangarajan, J. P. Surprise, John Isakson, John Badar, Doug Malone, Donald W. Plass, A. Aipperspach, Dieter F. Wendel, Robert M. Averill III, Ruchir Puri

IBM J. Res. Dev., 2015

Electronic packaging of the IBM z13 processor drawer.

Wiren Dale Becker, Hubert Harrer, Andreas Huber, W. L. Brodsky, R. Krabbenhoft, M. A. Cracraft, Dierk Kaller, Gregory R. Edlund, Thomas Strach

IBM J. Res. Dev., 2015

2014

Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module.

James D. Warnock, Yuen H. Chan, Hubert Harrer, Sean M. Carey, Gerard Salem, Doug Malone, Ruchir Puri, Jeffrey A. Zitz, Adam Jatkowski, Gerald Strevig, Ayan Datta, Anne Gattiker, Aditya Bansal, Guenter Mayer, Yiu-Hing Chan, Mark D. Mayo, David L. Rude, Leon J. Sigal, Thomas Strach, Howard H. Smith, Huajun Wen, Pak-kin Mak, Chung-Lung Kevin Shum, Donald W. Plass, Charles F. Webb

IEEE J. Solid State Circuits, 2014

Voltage Noise in Multi-Core Processors: Empirical Characterization and Optimization Opportunities.

Ramon Bertran, Alper Buyuktosunoglu, Pradip Bose, Timothy J. Slegel, Gerard Salem, Sean M. Carey, Richard F. Rizzolo, Thomas Strach

Proceedings of the 47th Annual IEEE/ACM International Symposium on Microarchitecture, 2014

2013

5.5GHz system z microprocessor and multi-chip module.

James D. Warnock, Yuen H. Chan, Hubert Harrer, David L. Rude, Ruchir Puri, Sean M. Carey, Gerard Salem, Guenter Mayer, Yiu-Hing Chan, Mark D. Mayo, Adam Jatkowski, Gerald Strevig, Leon J. Sigal, Ayan Datta, Anne Gattiker, Aditya Bansal, Doug Malone, Thomas Strach, Huajun Wen, Pak-kin Mak, Chung-Lung Kevin Shum, Donald W. Plass, Charles F. Webb

Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013

2012

Circuit and Physical Design Implementation of the Microprocessor Chip for the zEnterprise System.

James D. Warnock, Yiu-Hing Chan, Sean M. Carey, Huajun Wen, Patrick J. Meaney, Guenter Gerwig, Howard H. Smith, Yuen H. Chan, John Davis, Paul Bunce, Antonio Pelella, Daniel Rodko, Pradip Patel, Thomas Strach, Doug Malone, Frank Malgioglio, José Neves, David L. Rude, William V. Huott

IEEE J. Solid State Circuits, 2012

Electronic packaging of the IBM System z196 enterprise-class server processor cage.

Thomas Strach, Frank E. Bosco, Kenneth L. Christian, Kevin R. Covi, Martin Eckert, Gregory R. Edlund, Roland Frech, Hubert Harrer, Andreas Huber, Dierk Kaller, Martin Kindscher, A. Z. Muszynski, G. A. Peterson, Claudio Siviero, Jochen Supper, Otto A. Torreiter, Thomas-Michael Winkel

IBM J. Res. Dev., 2012

2011

A 5.2GHz microprocessor chip for the IBM zEnterprise™ system.

James D. Warnock, Y. Chan, William V. Huott, Sean M. Carey, Michael F. Fee, Huajun Wen, Mary Jo Saccamango, Frank Malgioglio, Patrick J. Meaney, Donald W. Plass, Yuen H. Chan, Mark D. Mayo, Guenter Mayer, Leon J. Sigal, David L. Rude, Robert M. Averill III, Michael H. Wood, Thomas Strach, Howard H. Smith, Brian W. Curran, Eric M. Schwarz, Lee Eisen, Doug Malone, Steve Weitzel, Pak-kin Mak, Thomas J. McPherson, Charles F. Webb

Proceedings of the IEEE International Solid-State Circuits Conference, 2011

2009

Packaging design challenges of the IBM System z10 Enterprise Class server.

Thomas-Michael Winkel, Hubert Harrer, Dierk Kaller, Jochen Supper, Daniel M. Dreps, Kenneth L. Christian, D. Cosmadelis, Tingdong Zhou, Thomas Strach, J. Ludwig, David L. Edwards

IBM J. Res. Dev., 2009