Xavier Baraton

According to our database, Xavier Baraton authored at least 3 papers between 2003 and 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2010

Interface delamination analysis of TQFP package during solder reflow.

Hu Guojun, Roberto Rossi, Jing-en Luan, Xavier Baraton

Microelectron. Reliab., 2010

2003

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications.

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong

Microelectron. Reliab., 2003

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill.

Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong

Microelectron. Reliab., 2003