Tong Yan Tee

According to our database, Tong Yan Tee authored at least 11 papers between 2003 and 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2010

Advances in Wafer Level Packaging (WLP).

Tong Yan Tee, Xuejun Fan, Yi-Shao Lai

Microelectron. Reliab., 2010

Advanced analysis on board trace reliability of WLCSP under drop impact.

Ahmer Syed, Tong Yan Tee, Hun Shen Ng, Rex Anderson, Choong Peng Khoo, Boyd Rogers

Microelectron. Reliab., 2010

2007

Dynamic responses and solder joint reliability under board level drop test.

Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong

Microelectron. Reliab., 2007

2006

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA.

Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong

Microelectron. Reliab., 2006

2004

Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages.

Tong Yan Tee, Zhaowei Zhong

Microelectron. Reliab., 2004

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis.

Tong Yan Tee, Zhaowei Zhong

Microelectron. Reliab., 2004

Impact life prediction modeling of TFBGA packages under board level drop test.

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong

Microelectron. Reliab., 2004

2003

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages.

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong

Microelectron. Reliab., 2003

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications.

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong

Microelectron. Reliab., 2003

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill.

Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong

Microelectron. Reliab., 2003

Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn.

Tong Yan Tee, Giovanni Frezza, Mayhuan Lim, Hun Shen Ng, Federico Ziglioli, Zhaowei Zhong

Int. J. Comput. Eng. Sci., 2003