Zhaowei Zhong

According to our database, Zhaowei Zhong authored at least 15 papers between 2002 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

A customer-centric IoT-based novel closed-loop supply chain model for WEEE management.

Rui Guo, Zhaowei Zhong

Adv. Eng. Informatics, January, 2023

2015

Nonlinearly enhanced vortex induced vibrations for energy harvesting.

Bao Huy Huynh, Tegoeh Tjahjowidodo, Zhaowei Zhong, Youyi Wang, Narasimalu Srikanth

Proceedings of the IEEE International Conference on Advanced Intelligent Mechatronics, 2015

2013

Correlation analysis of cutting force and acoustic emission signals for tool condition monitoring.

Zhaowei Zhong, J.-H. Zhou, Ye Nyi Win

Proceedings of the 9th Asian Control Conference, 2013

2007

Dynamic responses and solder joint reliability under board level drop test.

Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong

Microelectron. Reliab., 2007

2006

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA.

Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong

Microelectron. Reliab., 2006

Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints.

Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi

Microelectron. Reliab., 2006

Huge Proteins in The Human Proteome and Their Participation in Hereditary Diseases.

Meena Kishore Sakharkar, Pandjassarame Kangueane, Kishore R. Sakharkar, Zhaowei Zhong

Silico Biol., 2006

2004

Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages.

Tong Yan Tee, Zhaowei Zhong

Microelectron. Reliab., 2004

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis.

Tong Yan Tee, Zhaowei Zhong

Microelectron. Reliab., 2004

Impact life prediction modeling of TFBGA packages under board level drop test.

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong

Microelectron. Reliab., 2004

2003

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages.

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong

Microelectron. Reliab., 2003

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications.

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong

Microelectron. Reliab., 2003

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill.

Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong

Microelectron. Reliab., 2003

Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn.

Tong Yan Tee, Giovanni Frezza, Mayhuan Lim, Hun Shen Ng, Federico Ziglioli, Zhaowei Zhong

Int. J. Comput. Eng. Sci., 2003

2002

High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package.

Huimin Xie, Anand K. Asundi, Chai Gin Boay, Lu Yunguang, Jin Yu, Zhaowei Zhong, Bryan K. A. Ngoi

Microelectron. Reliab., 2002