Xiaodi Feng
According to our database1,
Xiaodi Feng authored at least 3 papers
between 2023 and 2026.
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Bibliography
2026
14.1 THz-TSI: A 0.33pJ/b 264Gb/s Through-Silicon Interconnect Module for 3D Integration Utilizing Terahertz Coupling.
Proceedings of the IEEE International Solid-State Circuits Conference, 2026
2023
Proceedings of the 15th IEEE International Conference on ASIC, 2023
A High Gain and Wide Bandwidth Dual-Power CMOS Op-amp for High-Speed ADCs Application.
Proceedings of the 15th IEEE International Conference on ASIC, 2023