Yi-Chieh Tsai

According to our database1, Yi-Chieh Tsai authored at least 2 papers in 2019.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

On csauthors.net:

Bibliography

2019
Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019


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