Chia-Hsuan Lee

Affiliations:
  • National Chiao Tung University, Hsinchu, Taiwan


According to our database1, Chia-Hsuan Lee authored at least 2 papers in 2019.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2019
Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019


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