Yida Li

Orcid: 0000-0002-5675-582X

Affiliations:
  • Southern University of Science and Technology, Shenzhen, Guangdong, China


According to our database1, Yida Li authored at least 12 papers between 2019 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2024
Realizing In-Memory Baseband Processing for Ultrafast and Energy-Efficient 6G.
IEEE Internet Things J., February, 2024

2023
A Low-Power DNN Accelerator Enabled by a Novel Staircase RRAM Array.
IEEE Trans. Neural Networks Learn. Syst., August, 2023

2021
A 70-μW 1.35-mm<sup>2</sup> Wireless Sensor With 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver.
IEEE J. Solid State Circuits, 2021

High-Throughput, Area-Efficient, and Variation-Tolerant 3-D In-Memory Compute System for Deep Convolutional Neural Networks.
IEEE Internet Things J., 2021

2020
A Wireless Multi-Channel Capacitive Sensor System for Efficient Glove-Based Gesture Recognition With AI at the Edge.
IEEE Trans. Circuits Syst. II Express Briefs, 2020

A $7\times7\times2$ mm<sup>3</sup> 8.6- $\mu$ W 500-kb/s Transmitter With Robust Injection-Locking-Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications.
IEEE J. Solid State Circuits, 2020

An 8.2- $\mu$ W 0.14-mm<sup>2</sup> 16-Channel CDMA-Like Capacitance-to-Digital Converter.
IEEE J. Solid State Circuits, 2020

23.2 A 70µW 1.19mm<sup>2</sup> Wireless Sensor with 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance.
Proceedings of the 2020 IEEE Sensors, Rotterdam, The Netherlands, October 25-28, 2020, 2020

Fledge: Flexible Edge Platforms Enabled by In-memory Computing.
Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition, 2020

2019
Design of Artificial Spiking Neuron with SiO2 Memristive Synapse to Demonstrate Neuron-Level Spike Timing Dependent Plasticity.
Proceedings of the International Conference on IC Design and Technology, 2019

A 7×7×2mm<sup>3</sup> 8.6-μ 500-kb/s Transmitter with Robust Injection-Locking Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2019


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