Yida Li
Orcid: 0000-0002-5675-582XAffiliations:
- Southern University of Science and Technology, Shenzhen, Guangdong, China
According to our database1,
Yida Li authored at least 20 papers
between 2019 and 2026.
Collaborative distances:
Collaborative distances:
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Bibliography
2026
VeRA+: Vector-Based Lightweight Digital Compensation for Drift-Resilient RRAM In-Memory Computing.
CoRR, March, 2026
7.8 A 55nm Intelligent Vision SoC Achieving 346TOPS/W System Efficiency via Fully Analog Sensing-to-Inference Pipeline.
Proceedings of the IEEE International Solid-State Circuits Conference, 2026
Mitigating Conductance Drift via In-Situ Calibration for Reliable RRAM-Based CIM Edge Inference.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2026
A 40-nm Resilient MLC RRAM Macro with Self-Referenced Time-Based Readout and 3-Bit Interleaved ECC Achieving 0.22 pJ/bit Read Energy.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2026
2025
A 22nm 29.3TOPS/W End-to-End CIM-Utilization-Aware Accelerator with Reconfigurable 4D-CIM Mapping and Adaptive Feature Reuse for Diverse CNNs and Transformers.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2025
2024
IEEE Internet Things J., February, 2024
A 0.72nW, 0.006mm<sup>2</sup> 32kHz Crystal Oscillator with Adaptive Sub-Harmonic Pulse Injection from -40°C to 125°C in 22nm FDSOI.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
2023
IEEE Trans. Neural Networks Learn. Syst., August, 2023
2022
Quantum Efficiency Enhancement in Si Avalanche Photodiodes in the NIR Regime via Surface Texturing Towards Autonomous Driving Applications.
Proceedings of the IEEE Asia Pacific Conference on Circuit and Systems, 2022
Proceedings of the IEEE Asia Pacific Conference on Circuit and Systems, 2022
2021
A 70-μW 1.35-mm<sup>2</sup> Wireless Sensor With 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver.
IEEE J. Solid State Circuits, 2021
High-Throughput, Area-Efficient, and Variation-Tolerant 3-D In-Memory Compute System for Deep Convolutional Neural Networks.
IEEE Internet Things J., 2021
2020
A Wireless Multi-Channel Capacitive Sensor System for Efficient Glove-Based Gesture Recognition With AI at the Edge.
IEEE Trans. Circuits Syst. II Express Briefs, 2020
A $7\times7\times2$ mm<sup>3</sup> 8.6- $\mu$ W 500-kb/s Transmitter With Robust Injection-Locking-Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications.
IEEE J. Solid State Circuits, 2020
An 8.2- $\mu$ W 0.14-mm<sup>2</sup> 16-Channel CDMA-Like Capacitance-to-Digital Converter.
IEEE J. Solid State Circuits, 2020
23.2 A 70µW 1.19mm<sup>2</sup> Wireless Sensor with 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020
Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance.
Proceedings of the 2020 IEEE Sensors, Rotterdam, The Netherlands, October 25-28, 2020, 2020
Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition, 2020
2019
Design of Artificial Spiking Neuron with SiO2 Memristive Synapse to Demonstrate Neuron-Level Spike Timing Dependent Plasticity.
Proceedings of the International Conference on IC Design and Technology, 2019
A 7×7×2mm<sup>3</sup> 8.6-μ 500-kb/s Transmitter with Robust Injection-Locking Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2019