Yu Dian Lim

According to our database, Yu Dian Lim authored at least 2 papers between 2019 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2021

Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions.

Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2019

Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration.

Jing Tao, Hongyu Li, Peng Zhao, Yu Dian Lim, Anak Agung Alit Apriyana, Chuan Seng Tan

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019