Chuan Seng Tan
Orcid: 0000-0003-1250-9165
According to our database1,
Chuan Seng Tan
authored at least 26 papers
between 2004 and 2021.
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Bibliography
2021
Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions.
Proceedings of the IEEE International 3D Systems Integration Conference, 2021
2020
Monolithically Integrated GaN+CMOS Logic Circuits Design and Electro-Thermal Analysis for High-Voltage Applications.
Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2020
2019
Mid Infrared Volatile Compounds Detection Using Thermally Reflowed Flip-Stack Die Linear Variable Filter.
Proceedings of the 2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019, 2019
Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2018
Two-Step Fabrication of Mid-Infrared Linear Variable Optical Filter Using SU-8 as Mask.
Proceedings of the 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2018
2017
Yield Enhancement of Face-to-Face Cu-Cu Bonding With Dual-Mode Transceivers in 3DICs.
IEEE Trans. Very Large Scale Integr. Syst., 2017
2016
Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation.
Microelectron. Reliab., 2016
Through-substrate via (TSV) with embedded capacitor as an on-chip energy storage element.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
2015
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
Microelectron. Reliab., 2014
Simulation and design of AIN piezoelectric resonator for infrared sensing application utilizing lamb wave mode.
Proceedings of the 2014 IEEE Ninth International Conference on Intelligent Sensors, 2014
2013
Reliable 3-D Clock-Tree Synthesis Considering Nonlinear Capacitive TSV Model With Electrical-Thermal-Mechanical Coupling.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013
Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model.
Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013
The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
2012
Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement.
Microelectron. Reliab., 2012
2011
Proceedings of the 3D Integration for NoC-based SoC Architectures, 2011
Integration schemes and enabling technologies for three-dimensional integrated circuits.
IET Comput. Digit. Tech., 2011
3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2010
Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement.
Proceedings of the IEEE International Conference on 3D System Integration, 2010
2009
Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack.
Proceedings of the IEEE International Conference on 3D System Integration, 2009
Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation.
Proceedings of the IEEE International Conference on 3D System Integration, 2009
2006
2004
Technology, performance, and computer-aided design of three-dimensional integrated circuits.
Proceedings of the 2004 International Symposium on Physical Design, 2004