Yutaka Igarashi

According to our database, Yutaka Igarashi authored at least 5 papers between 2017 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

T/R Switch Composed of Three HV-MOSFETs With 12.1-μW Consumption That Enables Per-Channel Self-Loopback AC Tests and -18.1-dB Switching Noise Suppression for 3-D Ultrasound Imaging With 3072-Ch Transceiver.

Shinya Kajiyama, Yutaka Igarashi, Toru Yazaki, Yusaku Katsube, Takuma Nishimoto, Tatsuo Nakagawa, Yohei Nakamura, Yoshihiro Hayashi, Takuya Kaneko, Hiroki Ishikuro, Taizo Yamawaki

IEEE Trans. Very Large Scale Integr. Syst., 2022

2021

A Low-Power Current-Reuse LNA for 3D Ultrasound Beamformers.

Yohei Nakamura, Shinya Kajiyama, Yutaka Igarashi, Takashi Oshima, Taizo Yamawaki

IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2021

2019

Single-Chip 3072-Element-Channel Transceiver/128-Subarray-Channel 2-D Array IC With Analog RX and All-Digital TX Beamformer for Echocardiography.

Yutaka Igarashi, Shinya Kajiyama, Yusaku Katsube, Takuma Nishimoto, Tatsuo Nakagawa, Yasuyuki Okuma, Yohei Nakamura, Takahide Terada, Taizo Yamawaki, Toru Yazaki, Yoshihiro Hayashi, Kazuhiro Amino, Takuya Kaneko, Hiroki Tanaka

IEEE J. Solid State Circuits, 2019

T/R-Switch Composed of 3 High-Voltage MOSFETs with 12.1 µW Consumption that can Perform Per-channel TX to RX Self-Loopback AC Tests for 3D Ultrasound Imaging with 3072-channel Transceiver.

Shinya Kajiyama, Yutaka Igarashi, Toru Yazaki, Yusaku Katsube, Takuma Nishimoto, Tatsuo Nakagawa, Yohei Nakamura, Yoshihiro Hayashi, Taizo Yamawaki

Proceedings of the IEEE Asian Solid-State Circuits Conference, 2019

2017

27.6 Single-chip 3072ch 2D array IC with RX analog and all-digital TX beamformer for 3D ultrasound imaging.

Yusaku Katsube, Shinya Kajiyama, Takuma Nishimoto, Tatsuo Nakagawa, Yasuyuki Okuma, Yohei Nakamura, Takahide Terada, Yutaka Igarashi, Taizo Yamawaki, Toru Yazaki, Yoshihiro Hayashi, Kazuhiro Amino, Takuya Kaneko, Hiroki Tanaka

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017