Z. Samsudin

According to our database, Z. Samsudin authored at least 2 papers between 2017 and 2021.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2021

No-flow underfill: Effect of chip placement speed on the void formation using numerical method.

Muhammad Naqib Nashrudin, Aizat Abas, M. Z. Abdullah, M. Yusuf Tura Ali, Z. Samsudin, Idris Mansor

Microelectron. J., 2021

2017

Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering.

A. M. Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad, Z. Samsudin, F. Che Ani

Microelectron. Reliab., 2017