Zheyao Wang

According to our database1, Zheyao Wang authored at least 13 papers between 2006 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2024
Hiding from thermal imaging pedestrian detectors in the physical world.
Neurocomputing, January, 2024

2023
Hiding from infrared detectors in real world with adversarial clothes.
Appl. Intell., December, 2023

2021
Fooling Thermal Infrared Pedestrian Detectors in Real World Using Small Bulbs.
Proceedings of the Thirty-Fifth AAAI Conference on Artificial Intelligence, 2021

2018
Research on a Novel MEMS Sensor for Spatial DC Electric Field Measurements in an Ion Flows Field.
Sensors, 2018

Fabrication of Chalcogenide Microlens Array Using Hot Embossing Method.
Proceedings of the 2018 IEEE SENSORS, New Delhi, India, October 28-31, 2018, 2018

2017
Fabrication of silicon nanowire pH sensors using high output, low cost sidewall mask technology.
Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017

2016
Delamination of bonding Interface between benzocyclobutene (BCB) and silicon dioxide/silicon nitride.
Microelectron. Reliab., 2016

Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive.
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016

2015
Air-gap/SiO2 liner TSVs with improved electrical performance.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013
Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners.
Microelectron. Reliab., 2013

A 15-bit two-step sigma-delta ADC with embedded compression for image sensor array.
Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013

2012
Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs).
Microelectron. Reliab., 2012

2006
Permittivity measurement of Ba<sub>0.5</sub>Sr<sub>0.5</sub>TiO<sub>3</sub> ferroelectric thin films on multilayered silicon substrates.
IEEE Trans. Instrum. Meas., 2006


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